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New type hot-melt adhesive and preparation method thereof

A hot-melt adhesive, a new type of technology, applied in the direction of adhesives, adhesive types, hydrocarbon copolymer adhesives, etc., can solve the problems that have not been reported in the application, achieve good suspension, high viscosity, and reduce product costs Effect

Inactive Publication Date: 2005-10-26
JIANGSU POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its application in the field of hot melt adhesives has not been reported

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment 1: Take 95 parts of the above basic product and add 5 parts of original attapulgite.

Embodiment 2～5

[0023] In the same preparation as in Example 1, the original attapulgite was replaced with whitening attapulgite, so that the contents were 5%, 10%, 15%, and 20%, respectively.

[0024] The product proportioning of embodiment 2~5 and test result are shown in Table 1:

[0025] Example

Embodiment 6～8

[0027] In the aforementioned basic products, add cohesive attapulgite to make the contents respectively 5%, 10%, and 20%. The product proportioning of embodiment 6~8 and test result are shown in Table 2:

[0028] Example

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PUM

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Abstract

The present invention relates to a new-type thermosol using attapulgite as additive and its preparation method. Its composition includes: main body resin ethylene and polyvinyl acetate copolymer EVA, etc. 20-50%, tackifying resin 20-50%, diluent 10-30%, attapulgite 2-40% and anti-oxidant 0.1-1%. Its preparation method includes the following steps: firstly, melting diluent, adding main body resin, when the main body resin basically molten, progressively adding tackifying resin and making reaction for 0.5-1.5 h at 130-180 deg.C, then adding attapulgite and anti-oxidant, further reacting for 0.5-1 hr., discharging material, forming and granulating so as to obtain the invented product.

Description

technical field [0001] The invention relates to a novel hot-melt adhesive using attapulgite as an additive and a preparation method thereof. Background technique [0002] Ethylene-vinyl acetate copolymer (EVA)-based hot-melt adhesives can be widely used in civil fields such as book binding, automatic packaging production lines, and carpet backing. As production automation increases, so does the demand for this product. [0003] The product is composed of main resin, tackifying resin, diluent and other raw materials, and its cost is relatively high. One of the means to reduce costs is to add some fillers to the components. The commonly used fillers are: calcium carbonate, silicon micropowder, talcum powder, white carbon black, light white carbon black, metal nitrides, metal oxides, etc., but these The disadvantage of fillers is that they are either heavy in proportion, easy to sink to the bottom, poor in dispersion, or too expensive. For example, United States Patent 6,750...

Claims

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Application Information

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IPC IPC(8): C09J123/08
Inventor 杜郢郁洪滨李效棠
Owner JIANGSU POLYTECHNIC UNIVERSITY
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