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Base plate of free standing diamond thick film for sound surface wave filter

A technology of diamond thick film and surface acoustic wave, which is applied in the field of material science, can solve the problems such as the difficulty of processing the growth surface of diamond film, achieve the effect of increasing the preparation cost and technical difficulty, solving technical problems, and increasing the response frequency

Inactive Publication Date: 2005-10-26
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
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AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a new type of functional material used in surface acoustic wave filters, that is, a free-standing diamond thick film without a substrate, which solves the problem of using the excellent performance of diamond to prepare high-frequency, high-durability devices
A method of using the nucleation surface of the diamond film as a functional surface is proposed, which solves the technical problem that the growth surface of the diamond film is difficult to process

Method used

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Embodiment Construction

[0007] The specific implementation steps of the present invention will be described in detail below in conjunction with the technical solutions.

[0008] step 1.

[0009] A diamond film with a thickness of 300-500 microns prepared by electron-enhanced thermal filament chemical vapor deposition (EA-CVD) is cut with a YAG laser cutting machine to prepare the required size for the device.

[0010] Step 2.

[0011] Since the deposition process of a thick diamond film takes 30-50 hours, and the grain size of polycrystalline diamond is tens to tens of microns, the roughness of the growth surface of the diamond film is very high, and due to the superhard and wear-resistant properties of the diamond film , it is very difficult to grind and polish the surface. Our solution is to use the side peeled off from the substrate (i.e. the diamond film nucleation surface), because it is peeled off from the substrate instantaneously due to the difference in thermal expansion coefficient betwee...

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Abstract

This invention relates to the application of inorganic nonmetal functional material in electric devices characterizing in applying a free pure diamond thick film without substrate as the bulk and substrate material used in a sound surface filter, applying the nucleation surface of a free-standing diamond thick film to be grinded and polished by mechanical and chemical process as the surface of a deposited interdigital converter and piezoelectric film and applying traditional preparation technology for semiconductor devices to prepare sound surface wave devices of ZnO / diamond lamination. This invention not only utilizes the high elastic factor and high sound velocity of the diamond, but also utilizing the advantage of the maximum heat conduction rate to make SAW devices have the property of large power and durability.

Description

technical field [0001] The invention belongs to the technical field of material science and relates to the application of inorganic non-metallic functional materials in electronic devices. Background technique [0002] Surface Acoustic Wave (SAW) filter is an important device used in the field of communication. In recent years, with the rapid development of communication technologies such as broadband, mobile and portable communication systems, the demand for high-frequency devices, especially GHz-level high-frequency devices, is increasing day by day. There are two ways to prepare high-frequency SAW devices: one is to use advanced semiconductor planar manufacturing technology to reduce the finger width and spacing of interdigital transducers. The development of this aspect is limited by planar manufacturing technology and has its development limit; the other One is to use high-acoustic-wave-transmission-velocity materials, combined with piezoelectric film materials on them...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/08
Inventor 白亦真杜国同
Owner DALIAN UNIV OF TECH
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