Imaging sensor mounting method and adhesive tape used thereby

A technology of image sensor and installation method, which is applied in the direction of film/sheet-shaped adhesives, adhesives, radiation control devices, etc., can solve the problems of electronic device damage, electronic device resistance reduction, etc., to reduce adhesion, prevent damage, and improve The effect of effective utilization

Inactive Publication Date: 2005-11-02
NITTO DENKO CORP
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Recently, with the miniaturization and high integration of electronic devices, circuits have become more precise. On the other hand, the resistance of electronic devices to discharge has decreased, and the phenomenon of so-called destruction of electronic devices has been caused by discharge when the adhesive tape is peeled off.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Imaging sensor mounting method and adhesive tape used thereby
  • Imaging sensor mounting method and adhesive tape used thereby
  • Imaging sensor mounting method and adhesive tape used thereby

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0088] In polyimide film (Toray Teyubon Co., Ltd. Ripton 100H: thickness 25μm, thermal conductivity at 170°C is 4.1×10 -4 cal / cm·sec·°C) is coated with a silicone adhesive (SD-4580 manufactured by Toray Dou Corning Co., Ltd.) to a thickness of 10 μm to form an adhesive tape, and attached to the surface glass of the CCD package . It was put into a reflow soldering furnace with a maximum temperature of 180°C x 5 seconds (about 90 seconds for a reflow furnace including waste heat, etc.), and mounted on a substrate. Among them, peel off the adhesive tape after the installation is finished.

[0089] As a result, damage or foreign matter was not confirmed on the surface after the stripping of the tape, and normal operation as a CCD was confirmed.

Embodiment 2

[0091] A quaternary ammonium salt (NR-121X manufactured by Colcoat Co., Ltd.) was applied to the back of the substrate of the adhesive tape on a substrate made of polyimide (Capton 100H manufactured by Toray Teubon Co., Ltd.) with a thickness of 25 μm. side. Subsequently, an acrylic adhesive solution was applied on the other side, and dried to obtain an adhesive tape in which an adhesive layer having a thickness of 10 μm was formed.

[0092] After heating this adhesive tape at 180° C. for about 1 hour, the adhesive force was measured in accordance with JIS Z0237, and it was 2.5 N / 19 mm, and the heat shrinkage rate was 0.1%. In addition, peeling of the adhesive tape was not observed, and the maximum value of the discharge capacity was 50 mV.

Embodiment 3

[0094] as above figure 2 As shown in (A), except that the adhesive tape is made into a tape shape with a protruding portion with a protruding length of 4 mm from the 11 mm × 12 mm square covering part through the arc-shaped side part of R = 2 (mm) , An adhesive tape was produced in the same manner as in Example 1. This adhesive tape was bonded to the surface glass of the CCD package, it was put into the reflow soldering furnace of 180 degreeC similarly to Example 1, and it mounted on the board|substrate.

[0095] Then, the adhesive tape can be peeled off from the protruding part without breaking the adhesive tape from the protruding part. No damage or adhesion of foreign matter was found on the surface after the tape was peeled off, and normal operation as a CCD was confirmed.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
transmittivityaaaaaaaaaa
Login to view more

Abstract

The objective is to provide a mounting method of a video sensor capable of attaining solder reflow in a state that an adhesive tape is adhered to a light receiving side of the video sensor and protecting the light receiving side of the video sensor even during the solder reflow in a mounting step of the video sensor employing a solid-state imaging device and to provide the protective adhesive tape used for the method. The mounting method is characterized in that solder connection reflow is applied to terminals of the video sensor with a board side by heating the terminals at a temperature of 170 [deg.]C or over while the adhesive tape employing a polyimide film for a configuration material of the its material is adhered to the light receiving side of the video sensor, the adhesive tape having an adhesive coated on one side and an anti-static agent coated on the other side. Further, at least a silicone group material is characterized in to be used for the adhesive configuration material of the adhesive tape.

Description

technical field [0001] The present invention relates to a mounting process of an image sensor using a solid-state imaging device. Background technique [0002] Image sensors using solid-state imaging devices have been widely used in digital cameras, video cameras, and the like in recent years. In the manufacturing process typified by the substrate-side mounting of these image sensors, damage to the surface of the image sensor or adhesion of dust is likely to directly affect imaging. Therefore, the method used is to use an adhesive tape as a surface protection tape and stick it on the light receiving part side of the image sensor, thereby avoiding damage or dust adhesion during mounting and manufacturing processes. [0003] On the other hand, when mounting an image sensor on a substrate or the like, a method of mounting the terminal portions by soldering one by one using a soldering iron has been used so far. In recent years, the number of terminals has increased dramatical...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50
Inventor 高野均近藤广行寺岛正
Owner NITTO DENKO CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap