Non-fan cooling device for CPU of passive baseplate type engineering controlled computer

Abstract

The invention relates to a heat-radiating device of CPU of industry controlling computers. Its characteristics are the back end surface of CPU is connected to the isolated hold that is cavity structure. The right end surface of the isolated hold sets a roundish hole, from front to back inside the isolated hold are respectively equipped CPU heat-radiating glued board, heat-leading tube and the fixing pedestal. The end extended from the inside of the roundish hole in the right end surface of the isolated hold of the heat-leading tube is connected with the heat-radiating organ comprised of front heat-radiating wing piece, the fixing bracket of heat-radiating equipments, back heat-radiating wing piece and semiconductor refrigeration piece; compared with present technology, the structure the present invention is novel, better solves the problem of heat-radiating inside host box, prolongs the usage longevity of the heat-radiating device, increases the reliability of the heat-radiating device, reduces the damage to other components in the time and course of fan replacing, and decreases the noises brought by traditional large power CPU fan; it equips the fixing bracket of heat-radiating equipments, and the installation is more firm.

Description

[technical field] [0001] The invention relates to a cooling device for an industrial control computer CPU, in particular to a fanless cooling device for the CPU of a passive backplane type industrial control computer. [Background technique] [0002] With the rapid development of science and technology, computers are also developing rapidly. The industrial control field is no exception. The computers on the industrial site can handle more and more events and the processing speed is getting faster and faster. The CPU of the processor will generate a higher temperature, especially in an industrial site, and the CPU temperature will be higher in a high-temperature environment. At present, the high-performance CPU heat dissipation method generally adopts a CPU fan to dissipate heat. The traditional CPU fan heat dissipation system includes: heat dissipation fins and fans. As the frequency of the CPU is getting faster and faster, the power consumption is also greater. In order to...

AI Technical Summary

Problems solved by technology

Although this method solves the problem of heat dissipation in high-temperature environments, the problems that cannot be ignored are: first, the fan is a mechanical product with a limited lifespan. Once the CPU fan is damaged, it will immediately cause a shutdown accident; second, the cooling fins between the fan and the CPU As the power consumption of the CPU increases, the mounting bracket of the CPU fan is often damaged due to transportation; the fan that runs at high speed also brings high machine noise. The noise index of industrial computers is between 55 and 60 decibels. When the air-conditioned room is quiet at night, it is difficult for the staff on duty to tolerate such noise.

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