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Spacer take-up device in processing mechanism of film carrier tape for mounting electronic component and method

A technology for electronic components and winding devices, applied in electrical components, electrical components, thin material processing and other directions, can solve the problems of wear, damage and damage of the film carrier tape, and achieve the effect of restraining deformation

Inactive Publication Date: 2006-01-11
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Thus, in the case where the separator 102 is wound on the reel 110 in a state where the ellipse deviates from the winding state or is eccentric with respect to the lateral direction of the separator, the tension fluctuates so much that the separator is supplied with the reel 102 in this state and A film carrier tape for mounting electronic components that is subject to predetermined processing while being wound onto another reel together with the film carrier tape for mounting electronic components may be subject to abrasion, damage, bending of inner leads, damage, etc.

Method used

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  • Spacer take-up device in processing mechanism of film carrier tape for mounting electronic component and method
  • Spacer take-up device in processing mechanism of film carrier tape for mounting electronic component and method
  • Spacer take-up device in processing mechanism of film carrier tape for mounting electronic component and method

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Embodiment Construction

[0031] Specific embodiments (embodiments) of the present invention will be described below with reference to the accompanying drawings.

[0032] figure 1 is a schematic diagram of a processing apparatus for film carrier tapes for mounting electronic components including a spacer winding apparatus according to the present invention, and figure 2 is a schematic view of the state of the reel wound by the separator winding device according to the present invention.

[0033] Such as figure 1 As shown, 10 denotes a processing apparatus for a film carrier tape for mounting electronic components according to the present invention as a whole.

[0034] Such as figure 1 As shown, a processing apparatus 10 for a film carrier tape for mounting electronic components (hereinafter referred to as “processing apparatus 10 ”) includes a conveying apparatus 12 , a processing section 14 and a winding apparatus 16 .

[0035] The processing section 14 performs predetermined processing such a...

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Abstract

The present invention provides a device and method for taking up a spacer which can prevent deformation, for example, the generation of a scratch on the surface of a film carrier tape for mounting an electronic component, the bending of an inner lead, surface damage, a fold caused by bending the film carrier tape, or the like. The feed driving shaft of the reel of the feeding device is coupled to a driving motor, and the take-up driving shaft of the spacer take-up device is coupled to a motor through a clutch, thereby taking up the spacer at a constant tension.

Description

technical field [0001] The present invention relates to a winding device and method for a spacer sheet that is fed together with a film carrier tape for mounting electronic components when carrying out a predetermined process, such as in a film carrier tape for mounting electronic components (TAB (Tape Automated Bonding) tape , T-BGA (Tape Ball Grid Array) Tape, CSP (Chip Scale Package) Tape, ASIC (Application Specific Integrated Circuit) Tape, COF (Film Chip) Tape, 2-Metal (Double-Sided Wiring) Tape and Multilayer Wiring Tape etc.) (hereinafter will be referred to as "film carrier tape for mounting electronic components") by matte coating photoresist, exposure, development, etching, debonding, screen printing, electroplating, electronic inspection or visual inspection test. Background technique [0002] With the development of the electronics industry, the demand for printed circuit boards to mount electronic components such as ICs (Integrated Circuits) and LSIs (Large Sca...

Claims

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Application Information

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IPC IPC(8): H01L21/60B65H23/195B65H23/198H01L21/00
CPCB65H23/1955B65H23/198H01L21/67132B65H23/195H05K13/02
Inventor 楢林哲之
Owner MITSUI MINING & SMELTING CO LTD
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