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Heat aggregation element

A component and heat-gathering technology, applied to electrical components, heat storage equipment, indirect heat exchangers, etc., can solve the problems of heat energy gathering and recycling difficulties, and achieve the effect of facilitating heat energy collection and utilization

Inactive Publication Date: 2006-01-18
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to solve the technical problem in the prior art that it is difficult to collect and recycle the heat energy emitted by electronic devices due to the heat diffusivity, the present invention provides a heat collecting device that can collect the heat energy emitted by electronic devices and facilitate heat energy recovery

Method used

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Examples

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Embodiment Construction

[0018] The heat collecting element provided by the embodiment of the present invention is described below in conjunction with the drawings:

[0019] see figure 1 , the heat collecting element 10 provided by the first embodiment of the present invention is a cuboid, which includes a heat collecting surface 11, a heat absorbing surface 12 opposite to the heat collecting surface 11, and a gap between the heat collecting surface 11 and the heat absorbing surface 12 The four surrounding sidewalls 13 connecting the heat-gathering surface 11 and the heat-absorbing surface 12, the heat-gathering element 10 is based on a heat-conducting material, and the heat-insulating material is doped in the heat-conducting material, wherein the thermal conductivity of the heat-conducting material is generally greater than 0.6W / M.K , The thermal conductivity of thermal insulation materials is generally less than 0.1W / M.K. The concentration distribution of the heat insulating material in the heat co...

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Abstract

The invention relates to a heat-accumulating unit, which is a polyhedral and comprises two opposed surfaces and circumferential sidewall. It uses a head conducing material as base body and mixes insulating material into the base body. The insulating material distributes from a surface to another surface with gathering density and from circumferential sidewall to center insulating material with degrading density.

Description

【Technical field】 [0001] The invention relates to a heat collecting element, in particular to a heat collecting element used in a cooling device for electronic components to facilitate heat energy recovery. 【Background technique】 [0002] With the rapid development of electronic technology in recent years, the high frequency and high speed of electronic components and the density and miniaturization of integrated circuits have caused a sharp increase in the heat generation of electronic components per unit volume. The heat generated is conducted to the air to ensure stable operation of electronic components. [0003] For example, reference may be made to US Patent No. 4,884,331 published on December 5, 1989 for the structure of a related heat dissipation device for assisting electronic components in dissipating heat. In the heat dissipation device, a plurality of heat dissipation fins are protruded on the top surface of the base. During operation, the base is attached to th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G12B15/06
CPCF28D20/0056H01L2924/0002Y10S165/042H01L23/38Y10S165/907Y10T428/252Y10T428/31663Y10T428/254Y10T428/249961Y10S165/909Y10T428/21Y10T428/259Y02E60/142H01L23/3733Y10T428/24997Y02E60/14H01L2924/00
Inventor 林志泉陈杰良
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD