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Method for preparing case seat of ceramic package for SMD parts and components

A technology of ceramic packaging and components, applied in electrical components, ceramic molding machines, electrical solid devices, etc., can solve problems such as inability to process ceramic films, and achieve the effect of stable product quality

Inactive Publication Date: 2006-02-01
邬明晖 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it can be found from the "New Ceramic Material Technology Handbook" that the thinnest thickness processed by the traditional rolling method is ≥0.8mm. It can be seen that the traditional rolling method cannot be used to process ceramic films that meet such a small thickness requirement.

Method used

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  • Method for preparing case seat of ceramic package for SMD parts and components

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Experimental program
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Embodiment Construction

[0042] Such as figure 1 Shown, the present invention provides a kind of SMD components and parts ceramic packaging shell preparation method, and it comprises the following steps:

[0043] A. Ingredients step

[0044] In the present invention, it is necessary to use porcelain slurry as the main material and various reagents as auxiliary materials. The auxiliary materials mainly include adhesives, plasticizers, metal pastes, casting agents, etc., wherein the adhesive is mainly It plays the role of bonding, the plasticizer plays the role of plasticizing and overcoming the influence of temperature difference in the process, the metal paste plays the role of connecting and conducting the ceramic parts and metal parts in the process, and the casting agent can make the ceramic parts in the process The shrinkage coefficient is the same.

[0045] The formulations of the above-mentioned porcelain slurry and each reagent are shown in the following corresponding Tables 1 to 5. When prep...

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Abstract

The method includes steps: ingredient, discharging air bubble in vacuum, preparing film prepared from flow casting, slice up, forming substrate, printing by metal pulp, laminating, cutting chip, discharging glue in low temperature, and ceramics sintering. Step of cutting chip is use for splitting ceramics film from carrier film, and cutting ceramics film to needed size. Step of forming substrate is to form substrate of ceramics film by die of punch. Step of printing by metal pulp prints metal pulp on ceramics substrate. Laminating step piles up substrates for lower, middle and upper layers, discharges air between layers by proper compressing to integrate three layers of chips. Step of cutting chip punches out single part of chip and case seat of ceramics. The invention can produce ceramics chip in thickness 0.20 + / - 0.02 mm in batch quantity with stable quality.

Description

【Technical field】 [0001] The invention relates to a method for preparing a ceramic packaging shell seat, in particular to a method for preparing a ceramic packaging shell seat for SMD components. 【Background technique】 [0002] At present, with the development of electronic products in the direction of short, thin, light, and small, the SMD components used in them also need to have extremely small dimensions. Correspondingly, the thickness of the ceramic packaging shell of SMD components is very thin. The total thickness of the ceramic package of some SMD components is about 0.7±0.05mm, and it is divided into three layers. The upper and lower layers are 0.25±0.02mm thick, and the middle layer is 0.2±0.02mm thick. The middle layer and the lower layer are pressed together to form a package housing. At this time, the ceramic thin film can be divided into two kinds of thicknesses, one kind of ceramic thin film has a thickness of 0.25±0.02mm, and the other kind of ceramic thin f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/00H05K3/46H01L49/00H05K3/12B28B1/00B29C55/00H05K3/38C04B35/10C09J129/04H10N99/00
Inventor 邬明晖余晓峰余金祥
Owner 邬明晖