Integrated circuit packaging structure and manufacturing method thereof

Abstract

The IC package structure comprises a base plate, an IC on base plate, an integrated heat sink plate composed of inner and outer surfaces that is arranged on top of IC chip with edge lower end fixed on base, and a carbon nano pipe array formed on the said inner surface with two ends vertical contact to integrated heat sink plate and IC chip; wherein, there is nano metal material of high thermal conductivity filled in the said pipe.

Description

【Technical field】 [0001] The invention relates to an integrated circuit packaging structure and a manufacturing method thereof, in particular to an integrated circuit packaging structure using a carbon nanotube array for heat conduction and a manufacturing method thereof. 【Background technique】 [0002] In the field of packaging of semiconductor integrated circuits, with the continuous improvement and development of semiconductor integrated circuits, their functions continue to increase while their volumes continue to decrease, their density continues to increase, and their packaging sizes continue to decrease. Since the integrated circuit chip performs calculation and processing in such a small space when it is working, it will inevitably generate a considerable amount of heat. The generated heat must be dissipated in an appropriate way to avoid calculation and processing errors due to overheating of the integrated circuit chip, and in severe cases, damage to the hardware c...

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Problems solved by technology

However, the semiconductor packaging structure based on this thermal interface material has disadvantages. First, due to the poor thermal conductivity of the polymer matrix material, the thermal interface material formed by mixing carbon nanotubes with the polymer matrix cannot fully utilize the carbon nanotubes. The thermal conductivity of nanotubes, and the thermal interface material will cause uneven heat conduction due to the uneven heating of the chip during application, which will affect the thermal conduction efficiency and stability of the entire thermal interface material, and further affect the packaging structure. second, the thermal interface material that mixes the carbon nanotube array in the polymer matrix in the above-mentioned semiconductor packaging structure is formed on the integrated circuit chip (DIE), because the integrated circuit chip cannot withstand the required heat for forming the carbon nanotube array. High temperature, so it is necessary to form the carbon nanotube array thermal interface material on the substrate in advance, and then fabricate the integrated circuit chip on the substrate. The manufacturing and packaging process is relatively complicated, which is not conducive to popularization and application.

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