Bimetallic compound Cu/Ag plate making process

Abstract

The bimetallic compound Cu / Ag plate making process includes the following steps: annealing hard industrial pure Cu and Ag base material at 250-300 deg.c, pre-tension straining, mechanically grinding to form composite surface of roughness Ra 12.5-50 micron, cold rolling for deformation of 5 % and pre-compounding, rolling at normal temperature or 200 deg.c for deformation of 70-80 % and physical compounding, and annealing and diffusion compounding at 400-450 deg.c for 2-4 hr. The prepared compound plate has nominal interface binding force of 40-45 N / mm, diffusion transition layer in the thickness of 10-14 micron, homogeneous structure and close interface binding. In addition, the present invention has also the effects of obvious technological stages, convenient parameter control, etc.

Description

technical field [0001] The invention relates to the preparation technology of metal layered composite materials. In particular, it relates to a method for preparing a Cu / Ag bimetallic composite board with uniform structure and tight interfacial bonding. Background technique [0002] Ag / Cu composite boards are generally used to manufacture contacts or elastic components of electronic devices such as various switches, relays, potentiometers and connectors. There are many ways to manufacture Ag / Cu composite plates, mainly solid-phase rolling, explosive welding, diffusion welding, seam welding, electroplating, sputtering and vapor deposition, etc. Among them, the solid-phase rolling method has the advantages of good material interface bonding, product size It has the advantages of high precision and easy industrial production. The composite mechanism of solid phase rolling is that under the action of rolling deformation, the distance between the contact interface of the two me...

AI Technical Summary

Problems solved by technology

[0007] In view of the above technical background about the preparation of bimetallic composite panels, it can be seen that although some composite technologies have produced good results, the composite surface targeted is not the Cu / Ag interface (such as the Cu / Al interface), because the properties of other metal interfaces and There are essential differences in the properties of the Cu / Ag interface, so this technology cannot be simply applied; although some technologies are aimed at the Cu / Ag interface, the material matrix contains other auxiliary alloying elements, that is, the materials on both sides of the interface have become alloys, and the interface The properties are significantly different from the pure Cu / Ag interface, and this technology cannot be directly applied; some technologies consider controlling the composite surface roughness to improve the composite performance, but only for the composite of synthetic resin and metal layer, not suitable for Cu / Ag interface; the large amount of composite deformation required in some composite technologies and the high quality of composite surface pretreatment require large-scale rolling equipment or rolling deformation at high temperatures to ensure composite quality, that is, process implementation It is difficult, and the obtained microstructure is not uniform, which is not suitable for mass production; although some studies have put forward more systematic results on the effect of a single process parameter in the material compounding process, they mainly reflect theoretical or mechanistic content. It can only be used to guide application research, and cannot be directly used as the process conditions for preparing Cu / Ag bimetallic composite panels

Images