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Removing apparatus, protective film forming apparatus, substrate processing system and removing method

A technology for forming equipment and protective film, which is applied to optical mechanical equipment, photo-engraving process coating equipment, photosensitive materials for optical mechanical equipment, etc., and can solve the problem of increasing the number of substrate processing steps and other problems

Inactive Publication Date: 2006-04-05
株式会社迅动
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the organic waste generated by the removal process must be disposed of, which disadvantageously increases the number of steps required for the overall substrate processing

Method used

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  • Removing apparatus, protective film forming apparatus, substrate processing system and removing method
  • Removing apparatus, protective film forming apparatus, substrate processing system and removing method
  • Removing apparatus, protective film forming apparatus, substrate processing system and removing method

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Embodiment Construction

[0027] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0028] 1. Structure of substrate processing system

[0029] figure 1 An exemplary structure of the substrate processing system 100 according to the present embodiment is shown. The substrate processing system 100 sequentially forms an anti-reflection film coating, a photoresist film and a cover film on the substrate, and performs development processing on the substrate after exposure processing.

[0030] Such as figure 1 As shown, the substrate processing system 100 according to this embodiment is roughly formed by an indexer block (indexer block) 1 and an interface block (interface block) 6 arranged in parallel to each other, wherein the indexer block 1 is used to perform predetermined chemical solution processing on a substrate The processing area (more specifically, the antireflective coating processing area 2, the resist film processing area 3, th...

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Abstract

An application processing unit forms a cover film of a component soluble in an aqueous alkaline solution on the surface of a substrate formed with a resist film. The application processing unit can supply a developer used in a development processing unit as a remover for removing a cover film component adhering to the peripheral edge of the substrate. Thus, it is possible to selectively remove the cover film from the peripheral edge of the substrate without influencing the resist film.

Description

technical field [0001] The present invention relates to a removal device, a protective film forming device, a substrate processing system and a removal method for removing a protective film, wherein the formed protective film is used to cover a semiconductor substrate, a glass substrate of a liquid crystal display or a photomask, an optical disk substrate etc. (hereinafter simply referred to as "substrate"); the present invention particularly relates to improvements in the effective removal of protective films. Background technique [0002] There is generally known a technique of forming a thin film by applying a coating liquid to a substrate while rotating the substrate. In addition, there is known a technique for removing excess portions of the film adhered to the outer periphery of the substrate during the film forming process. [0003] There is also generally known a technique concerning immersion exposure, which performs an exposure process while filling a gap between ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/16G03F7/30G03F7/00
CPCG03F7/168G03F7/11G03F7/3057G03F7/7075H01L21/67017
Inventor 金山幸司茂森和士
Owner 株式会社迅动