Method and equipment for fabricating structure of compound crystal

Abstract

The method improves capability of technique for packing tranditional photoelectric chip for example chip of optical sensor. Photoelectric chip is bonded on prearranged position of transparent base plate (such as glass base plate), where there is circuit layout. A joining pad connects the photoelectric chip to the transparent base plate at the prearranged place. After an existed sealed hollow interlayer is detected, then structure of each chip is cut to each simple piece, which is assembled to module according to specification. Being different to traditional encapsulation, the invention raises rate of good product, and saves material.

Description

technical field [0001] The present invention relates to a flip-chip manufacturing method and its device. It has the ability to improve the packaging technology of traditional photoelectric chips such as photosensor chips. The photoelectric chip is combined with a predetermined area on a transparent substrate with a circuit layout layer through a conductive material. Electrically connect the optoelectronic chip and the predetermined area of ​​the transparent substrate, and determine that an empty interlayer is formed between the chip and the transparent substrate, and then cut each chip structure into a single body, and assemble it into a module according to the specification, Re-provide packaging technology that is different from traditional optoelectronic chips. Background technique [0002] In recent years, electronic products have developed towards lightness, thinness, shortness, smallness, and high functionality. The packaging market has also evolved with the trend of hi...

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Problems solved by technology

As in the aforementioned manufacturing process, if particles or dust fall directly on the microlens of the chip 20b during the assembly process, fatal image spots are formed, and the dust falling on the microlens cannot be removed in other ways, which will cause Product failure (fail); therefore, the lens film block assembly process of the entire packaging process must be carried out in a very high clean room (such as, Class10 Clean Room) to improve the yield; however, the cost of such a clean room Not only does it have to fully accommodate the machines required for any of the above-mentioned procedures, but it must also be assembled and tested in such a clean room. Not only is the cost of the equipment high, but the control of the clean room is slightly different, such as fast wire bonding (wire bound) caused by air flow disturbance and driving particles, which can easily affect product yield

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