Method and equipment for fabricating structure of compound crystal

A manufacturing method and flip chip technology, applied in microstructure devices, measurement devices, semiconductor/solid-state device manufacturing, etc., can solve problems such as high equipment costs, impact on product yield, and clean room costs.
CN1761042AInactive Publication Date: 2006-04-19欣相光电股份有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
欣相光电股份有限公司
Publication Date
2006-04-19
Estimated Expiration
Not applicable · inactive patent

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Abstract

The method improves capability of technique for packing tranditional photoelectric chip for example chip of optical sensor. Photoelectric chip is bonded on prearranged position of transparent base plate (such as glass base plate), where there is circuit layout. A joining pad connects the photoelectric chip to the transparent base plate at the prearranged place. After an existed sealed hollow interlayer is detected, then structure of each chip is cut to each simple piece, which is assembled to module according to specification. Being different to traditional encapsulation, the invention raises rate of good product, and saves material.
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Description

technical field

[0001] The present invention relates to a flip-chip manufacturing method and its device. It has the ability to improve the packaging technology of traditional photoelectric chips such as photosensor chips. The photoelectric chip is combined with a predetermined area on a transparent substrate with a circuit layout layer through a conductive material. Electrically connect the optoelectronic chip and the predetermined area of ​​the transparent substrate, and determine that an empty interlayer is formed between the chip and the transparent substrate, and then cut each chip structure into a single body, and assemble it into a module according to the specification, Re-provide packaging technology that is different from traditional optoelectronic chips. Background technique

[0002] In recent years, electronic products have developed towards lightness, thinness, shortness, smallness, and high functionality. The packaging market has also evolved with the trend of hi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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