Method and equipment for fabricating structure of compound crystal

A manufacturing method and flip chip technology, applied in microstructure devices, measurement devices, semiconductor/solid-state device manufacturing, etc., can solve problems such as high equipment costs, impact on product yield, and clean room costs.

Inactive Publication Date: 2006-04-19
欣相光电股份有限公司
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  • Summary
  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

As in the aforementioned manufacturing process, if particles or dust fall directly on the microlens of the chip 20b during the assembly process, fatal image spots are formed, and the dust falling on the microlens cannot be removed in other ways, which will cause Product failure (fail); therefore, the lens film block assembly process of the entire packaging process must be carried out in a very high clean room (such as, Class10 Clean Room) to improve

Method used

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  • Method and equipment for fabricating structure of compound crystal
  • Method and equipment for fabricating structure of compound crystal
  • Method and equipment for fabricating structure of compound crystal

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Embodiment Construction

[0046] See Figure 3 with Figure 4A to Figure 4F First obtain a transparent substrate 10, then bond the chip 20 to the transparent substrate 10, cooperate with the pre-arranged circuit layout layer 12 of the transparent substrate 10 to be electrically connected to the chip 20, and make sure that the inside is sealed and formed without being protected from the outside world. Interfering airtight interlayer 40 to form a so-called flip-chip device; the empty interlayer 40 is used to improve the image sensitivity of the flip-chip device; in addition, the transparent substrate 10 of the present invention has the circuit layout The layer 12 and the chip 20 are combined through the bonding pad 30, and at the same time have the functions of a circuit carrier and isolating dust; after completing the above simple steps, you can leave the excellent clean room to enter the subsequent process, such as for each The chip structure is cut into a single body, and can be assembled into a module...

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Abstract

The method improves capability of technique for packing tranditional photoelectric chip for example chip of optical sensor. Photoelectric chip is bonded on prearranged position of transparent base plate (such as glass base plate), where there is circuit layout. A joining pad connects the photoelectric chip to the transparent base plate at the prearranged place. After an existed sealed hollow interlayer is detected, then structure of each chip is cut to each simple piece, which is assembled to module according to specification. Being different to traditional encapsulation, the invention raises rate of good product, and saves material.

Description

technical field [0001] The present invention relates to a flip-chip manufacturing method and its device. It has the ability to improve the packaging technology of traditional photoelectric chips such as photosensor chips. The photoelectric chip is combined with a predetermined area on a transparent substrate with a circuit layout layer through a conductive material. Electrically connect the optoelectronic chip and the predetermined area of ​​the transparent substrate, and determine that an empty interlayer is formed between the chip and the transparent substrate, and then cut each chip structure into a single body, and assemble it into a module according to the specification, Re-provide packaging technology that is different from traditional optoelectronic chips. Background technique [0002] In recent years, electronic products have developed towards lightness, thinness, shortness, smallness, and high functionality. The packaging market has also evolved with the trend of hi...

Claims

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Application Information

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IPC IPC(8): H01L21/50H01L23/48H01L31/00B81B7/00
CPCH01L2224/48091H01L2224/48227
Inventor 刁国栋
Owner 欣相光电股份有限公司
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