Radiating fin fixing device
A technology of fixing device and heat sink, applied in elastic/clamping device, cooling/ventilation/heating transformation, circuit arrangement on support structure, etc., can solve problems such as deformation of fixing device 2, weak mechanical strength, poor contact, etc. Achieve the effect of avoiding breakage of transistor pins, increasing bending stress, and increasing tin area
Inactive Publication Date: 2006-04-26
DELTA ELECTRONICS INC
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Problems solved by technology
The heat sink 1 has a certain weight, if it is not firmly positioned on the printed circuit board 3 due to the weak mechanical strength of the pin 22 or insufficient tin due to the small area of the pin 22 during assembly, transportation or use, it will cause Fixture 2 is deformed and cannot effectively support heat sink 1
Furthermore, the shaking force will also be transmitted to the transistor (not shown) locked on the heat sink 1 through the fixing device 2, causing the pins of the transistor inserted into the printed circuit board 3 to break
In addition, the above-mentioned force will also be transmitted to the printed circuit board 3 through the pins of the transistor (not shown), causing the copper foil on the printed circuit board 3 to lift or break, or to cause the pins 22 to be fixed on the tin of the printed circuit board 3 to break. Or tilting, causing the heat sink 1 to be poorly fixed and dumped, which in turn affects the connection line of the printed circuit board 3, and the lighter ones cause poor contact, and the more serious ones will form a short circuit
Method used
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[0038] see figure 2 , which shows a schematic structural view of fixing a heat sink to a printed circuit board using a heat sink fixing device according to a preferred embodiment of the present invention. Such as figure 2 As shown, a fixing device 5 is provided at the bottom of the heat sink 4 for fixing the heat sink 4 to the printed circuit board 6 . The heat sink 4 is mainly made of metal materials with high thermal conductivity such as aluminum and copper, and the shape can be changed according to needs to increase the heat dissipation area. The heat sink 4 can lock a high-power transistor (not shown) on the heat sink 4 , thereby providing a heat dissipation area in a direction perpendicular to the printed circuit board 6 to dissipate heat.
[0039]The fixing device 5 of the heat sink 4 includes a connecting portion 51, an extension portion 52, a first pin 53 and a second pin 54, wherein the connecting portion 51 is riveted and fixed on any side of the bottom of the he...
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The invention belongs to a fixing device for cooling fin to fix the fin on a printed board, which comprises: a joint part fixed on one side of the fin, an extension connected to the joint part, a first edge foot extended downward from part edge of joint part bottom to insert into the board, and a second edge foot extended downward from part edge of extension bottom to connect with the first one and insert into the board. This invention can reinforce the folding stress of edge feet, enlarges area for tin, and avoids affecting the connection line of the board.
Description
technical field [0001] The invention relates to a fixing device, in particular to a cooling fin fixing device. Background technique [0002] For a long time, heat sinks have been an indispensable component to solve the internal heat dissipation problems of various electronic devices. Take the power supply system (powersupply) applicable to flat-panel liquid crystal displays or notebook computers as an example. The printed circuit board is equipped with The main electronic components include capacitors, resistors, inductors, transformers, diodes, metal oxide semiconductor field effect transistors (MOSFETs) and bare crystals. When the power supply system is in operation, these electronic components will generate heat of varying power. If the heat is not transferred efficiently, the excess heat can cause electronic components to fail, or even prevent the entire system from functioning. Therefore, the heat sink becomes an important component to solve the internal heat dissipati...
Claims
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IPC IPC(8): H05K7/12H05K1/02H05K7/20
Inventor 罗文权
Owner DELTA ELECTRONICS INC