Supercharge Your Innovation With Domain-Expert AI Agents!

Semiconductor laser unit and optical pickup device including the semiconductor laser unit

A laser and semiconductor technology, applied in the structural details of semiconductor lasers, semiconductor lasers, semiconductor devices, etc., can solve problems such as difficulty in ensuring positional accuracy, complicated operations, and complicated processes, and achieve thinning, easy assembly, and high heat dissipation efficiency. Effect

Inactive Publication Date: 2006-05-31
PANASONIC CORP
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there are problems in that the process of manufacturing semiconductor laser modules becomes complicated, the work time cannot be shortened, and it is difficult to ensure positional accuracy.
In addition, the electrical connection between the semiconductor laser 1050 and the light receiving element 1060 is performed by wire bonding to the terminal part 1030 of the flexible substrate 1040, such as Figure 4 As shown, it is bent and then bonded to the metal island 1000, so there is a problem that the work at the time of manufacture becomes complicated and it is difficult to maintain the bonding strength.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor laser unit and optical pickup device including the semiconductor laser unit
  • Semiconductor laser unit and optical pickup device including the semiconductor laser unit
  • Semiconductor laser unit and optical pickup device including the semiconductor laser unit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0056] First, refer to Figure 5 and Image 6 The semiconductor laser module of Embodiment 1 will be described.

[0057] Figure 5 It is an assembled perspective view of the semiconductor laser module of the first embodiment. Image 6 A is a plan view of the semiconductor laser module of Embodiment 1, Image 6 B is a side view of the semiconductor laser module of the first embodiment.

[0058] The semiconductor laser module of Embodiment 1 has a simple structure that is easy to assemble, heats up heat easily, and achieves high functionality and miniaturization.

[0059] use Figure 5 The configuration of the semiconductor laser module according to Embodiment 1 will be described with respect to an assembled perspective view of FIG.

[0060] First, if Figure 5 As shown in A, an opening is provided in the center of a thin central portion (hereinafter referred to as "recess") 100a of the metal plate 100, and a flexible substrate 130 having a width wider than the width of t...

Embodiment approach 2

[0087] Next, refer to Figure 8 and Figure 9 A semiconductor laser module according to Embodiment 2 will be described.

[0088] Figure 8 It is an assembled perspective view of the semiconductor laser module of the second embodiment. Figure 9 A is a top view of the semiconductor laser assembly, Figure 9 B is a side view of the semiconductor laser assembly. and, with Figure 5 and Image 6 The same elements are assigned the same symbols, and detailed descriptions thereof are omitted.

[0089] In the semiconductor laser module of the second embodiment, as in the semiconductor laser module of the first embodiment, the thickness of the metal plate 100 (protrusion 100b and convex part 100c) in the region where the frame body 150 is provided is smaller than that of the silicon substrate 120. The thickness of the region (recess 100 a ) with the flexible substrate 130 is thick.

[0090] However, the semiconductor laser module of Embodiment 2 differs from the semiconductor l...

Embodiment approach 3

[0098] Next, refer to Figure 10 An optical pickup device according to Embodiment 3 will be described.

[0099] Figure 10 A is a plan view of an optical pickup device 600 according to Embodiment 3, Figure 10 B is a cross-sectional view of the optical pickup device 600 .

[0100] Optical pick-up device 600 is the device that reads data from optical disk 670, comprises: collimating lens 610, reflection mirror 620, object lens 630, semiconductor laser assembly 640 and heat dissipation block 650 of embodiment 1 or 2, and this heat dissipation block uses adhesive For example, a silicon-based thermally conductive adhesive is bonded and fixed to the back surface of the metal plate of the semiconductor laser module 640 .

[0101] The external optical pick-up device of the flexible substrate of the semiconductor laser assembly 640 is connected to the wiring of the flexible substrate, such as Figure 10 As shown in B, it is performed at the soldering place 660 outside the optical ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a semiconductor laser assembly, which has high heat dissipation efficiency, miniaturization, high integration of optical elements, no dust pollution of light-emitting elements, and an easy-to-assemble structure. The semiconductor laser module has: a metal plate provided with a first recess in the upper central portion; a flexible substrate provided with a first opening located in the first recess and bent to face the metal plate. A pair of side surfaces are in contact with the first concave portion and have a wiring pattern; the receiving and emitting portion has a light emitting element and a light receiving element, and is arranged in the first concave portion through the first opening; the frame body has a side surface and an upper surface, and the side surface The above-mentioned flexible substrate that is in contact with the two side surfaces is fixed on the two side surfaces, the upper part is arranged on the convex part of the above-mentioned metal plate to cover the above-mentioned first concave part, and there is a a second opening; and an optical element blocking the second opening.

Description

technical field [0001] The present invention relates to a semiconductor laser unit, in particular to a semiconductor laser unit constituting an optical pick-up device, and an optical pick-up unit provided with the semiconductor laser unit. CD) and other recording media to write information, or read the written information. Background technique [0002] In recent years, CD series (CD-ROM, CD-R, CD-RW, etc.) and DVD series (DVD-ROM, DVD-RW, DVD- RAM, etc.) recording media. At the same time, optical disk drives for writing information to such recording media or reading written information are rapidly spreading. In the optical pickup device, which is the core component of the optical disc drive, there is a strong demand for higher power of light for high-speed recording, higher functionality for compatibility with both CD and DVD standards, and accompanying thinning of the optical disc drive. miniaturization. Therefore, in semiconductor laser modules used in optical pickup d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G11B7/12G11B7/125H01S5/02
CPCH01L2224/45144H01L2224/48091H01L2224/49171H01S5/02216H01S5/02253H01S5/02325H01L2924/00014H01L2924/00G11B7/127
Inventor 富士原洁南尾匡纪立柳昌哉冈本重树
Owner PANASONIC CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com