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Method for treating surface of probe installed on testing card

A technology of test cards and probes, which is applied to the components of electrical measuring instruments, semiconductor/solid-state device testing/measurement, and electrical measurement, and can solve problems such as electromagnetic interference, increased retest rate, and reduced test effect

Inactive Publication Date: 2006-06-28
王志忠 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is known that the probes 13 are made of conductive materials, and the probes 13 are closely spaced, so there will be electromagnetic interference between the multiple probes 13, or foreign objects may fall between the probes 13. A short circuit occurs in the gap between them, so that the probe 13 cannot work normally
Generally speaking, the probe 13 will have contact wear, and the severity of the wear will affect the test reliability and service life of the test card 1, and the contact end 132 surface 133 of the probe 13 is easy to wear for a long time, and the contact end 132 is affected by the wear and tear. The worn surface 133 will be uneven, such as Figure 3B As shown, residues and dirt 18 are easy to be attached and are difficult to remove, so that the test effect of the object under test 19 is greatly reduced, and the retest rate is increased. 133 can be reused after grinding and trimming, but the length of the probe 13 will be shortened after multiple grinding and trimming. When the length of the probe 13 is ground to a certain value, it can no longer be used and must be discarded to reduce its service life. The cost is very high, such use will lead to a substantial increase in cost, and it is uneconomical

Method used

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  • Method for treating surface of probe installed on testing card
  • Method for treating surface of probe installed on testing card
  • Method for treating surface of probe installed on testing card

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The present invention is mainly to coat the surface of the probe 2 on the test card. The probe 2 can be made of rigid and conductive materials such as tungsten metal or tungsten alloy, such as Figure 5A As shown, the implementation method is as follows, please refer to Figure 4 Shown:

[0031] a. Cover the test card and the 22 part of the needle body of the probe 2 and only expose the 21 part of the needle;

[0032] b. Place the shielded test card and probe 2 in the coating device: the coating device can be a vacuum electroplating furnace;

[0033] c. Plating a conductive coating 3 on the surface of the needle 21 of the unshielded probe 2 to form a protective layer, such as Figure 5B Shown

[0034] d. After the probe 2 on the test card is worn and worn, the surface of the probe 2 should be trimmed: first remove the residue and dirt 31 remaining on the surface of the film 3, and then perform grinding and trimming, such as Figure 5C , Figure 5D Shown

[0035] e. Cover th...

Embodiment 2

[0038] The film 3 on the surface of the probe 2 on the test card will wear out after use, such as Figure 5C As shown, another embodiment of the present invention is mainly to trim and coat the surface of the probe 2 on the test card. The implementation method is as follows, please refer to Figure 6 Shown:

[0039] a. Trim the surface of the probe 2: first remove the residue and dirt 31 remaining on the surface of the film 3, and then perform grinding and trimming, such as Figure 5D Shown.

[0040] b. Cover the parts of the test card and probe 2 that do not need to be coated, and only expose the surface of the probe 2 to be processed;

[0041] c. Place the shielded test card and probe 2 in the coating device: the coating device is a vacuum electroplating furnace;

[0042] d. Plating a conductive film 32 on the surface of the unshielded probe 2 to form a protective layer, such as Figure 5E Shown.

[0043] The materials of the coatings 3, 32 can be different according to the diff...

Embodiment 3

[0046] Another embodiment of the present invention is that the probes 2 on the test card are arranged closely spaced to prevent electromagnetic interference between the probes 2 and short circuit caused by the falling of foreign objects and the probes. , The method of coating the probe surface is as follows, such as Figure 7 , Figure 8 Shown:

[0047] a. Cover the needle body 22 of the probe 2 and only expose the needle 21 part;

[0048]b. Place the shielded probe 2 in the coating device: the coating device is a vacuum electroplating furnace;

[0049] c. Plating a conductive film 3 on the surface of the needle 21 of the unshielded probe 2;

[0050] d. Cover the needle 21 part of the probe 2 again, and only expose the 22 part of the needle body;

[0051] e. Place the shielded probe 2 in the coating device;

[0052] f. A non-conductive insulating film 4 is plated on the surface of the needle body 22 of the unshielded probe 2 to form an insulating protective layer.

[0053] In this ...

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PUM

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Abstract

A method for processing surface of probe set on test card includes carrying out film coating treatment at surface of probe to form covering film on probe surface. The material of covering film can be metal or alloy or nonmetal material to have probe surface repaired and to decrease foreign matters attached on probe surface.

Description

Technical field [0001] The invention relates to a method for surface treatment of a probe installed on a test card. Background technique [0002] Usually, the general test object (such as wafer, IC, DRAM... etc.) must be tested by the test machine to verify whether the test object meets the functional characteristics required by the design, and the product quality is guaranteed by eliminating defective products , And the test card 1 on the test machine, please refer to figure 1 , figure 2 As shown, the circuit board 11 is mainly included. The circuit board 11 is provided with a positioning seat 12, and a number of probes 13 are arranged and fixed on the positioning seat 12. The probes 13 are connected to the circuit board 11 through a wire 14. A general probe 13 is made of conductive metal or other conductive materials, such as Figure 3A As shown, one end of the probe 13 is a fixed end 131, which is fixed on the positioning base 12, and the other end is a contact end 132, whic...

Claims

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Application Information

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IPC IPC(8): G01R1/02G01R1/067G01R1/18H01L21/66
Inventor 王志忠吕文裕
Owner 王志忠