Method for treating surface of probe installed on testing card
A technology of test cards and probes, which is applied to the components of electrical measuring instruments, semiconductor/solid-state device testing/measurement, and electrical measurement, and can solve problems such as electromagnetic interference, increased retest rate, and reduced test effect
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Embodiment 1
[0030] The present invention is mainly to coat the surface of the probe 2 on the test card. The probe 2 can be made of rigid and conductive materials such as tungsten metal or tungsten alloy, such as Figure 5A As shown, the implementation method is as follows, please refer to Figure 4 Shown:
[0031] a. Cover the test card and the 22 part of the needle body of the probe 2 and only expose the 21 part of the needle;
[0032] b. Place the shielded test card and probe 2 in the coating device: the coating device can be a vacuum electroplating furnace;
[0033] c. Plating a conductive coating 3 on the surface of the needle 21 of the unshielded probe 2 to form a protective layer, such as Figure 5B Shown
[0034] d. After the probe 2 on the test card is worn and worn, the surface of the probe 2 should be trimmed: first remove the residue and dirt 31 remaining on the surface of the film 3, and then perform grinding and trimming, such as Figure 5C , Figure 5D Shown
[0035] e. Cover th...
Embodiment 2
[0038] The film 3 on the surface of the probe 2 on the test card will wear out after use, such as Figure 5C As shown, another embodiment of the present invention is mainly to trim and coat the surface of the probe 2 on the test card. The implementation method is as follows, please refer to Figure 6 Shown:
[0039] a. Trim the surface of the probe 2: first remove the residue and dirt 31 remaining on the surface of the film 3, and then perform grinding and trimming, such as Figure 5D Shown.
[0040] b. Cover the parts of the test card and probe 2 that do not need to be coated, and only expose the surface of the probe 2 to be processed;
[0041] c. Place the shielded test card and probe 2 in the coating device: the coating device is a vacuum electroplating furnace;
[0042] d. Plating a conductive film 32 on the surface of the unshielded probe 2 to form a protective layer, such as Figure 5E Shown.
[0043] The materials of the coatings 3, 32 can be different according to the diff...
Embodiment 3
[0046] Another embodiment of the present invention is that the probes 2 on the test card are arranged closely spaced to prevent electromagnetic interference between the probes 2 and short circuit caused by the falling of foreign objects and the probes. , The method of coating the probe surface is as follows, such as Figure 7 , Figure 8 Shown:
[0047] a. Cover the needle body 22 of the probe 2 and only expose the needle 21 part;
[0048]b. Place the shielded probe 2 in the coating device: the coating device is a vacuum electroplating furnace;
[0049] c. Plating a conductive film 3 on the surface of the needle 21 of the unshielded probe 2;
[0050] d. Cover the needle 21 part of the probe 2 again, and only expose the 22 part of the needle body;
[0051] e. Place the shielded probe 2 in the coating device;
[0052] f. A non-conductive insulating film 4 is plated on the surface of the needle body 22 of the unshielded probe 2 to form an insulating protective layer.
[0053] In this ...
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