Substrate processing apparatus and transfer positioning method thereof

A substrate processing device and positioning method technology, applied in the direction of conveyor objects, transportation and packaging, electrical components, etc., can solve the problems that it is impossible to fully ensure the height position accuracy, time and labor are required

Active Publication Date: 2006-07-19
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in this method, for example, when performing rough teaching work, there is a process of visual and manual work by a worker, so there is a problem that time and labor are required in this process.
In addition, in the teaching work using the positioner, since the teaching work is for the horizontal direction, there is also a problem that it is impossible to ensure sufficient positional accuracy in the height (Z axis)

Method used

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  • Substrate processing apparatus and transfer positioning method thereof
  • Substrate processing apparatus and transfer positioning method thereof
  • Substrate processing apparatus and transfer positioning method thereof

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Embodiment Construction

[0019] Hereinafter, the present invention will be described in detail as one embodiment with reference to the drawings. figure 1 Shown is the overall structure of a substrate processing apparatus according to one embodiment of the present invention. Such as figure 1 As shown, a vacuum transfer chamber 10 is provided in the central part of the substrate processing apparatus 1, and a plurality of (six in this embodiment) vacuum processing chambers ( processing chamber) 11-16.

[0020] Two load locking chambers (load locking chambers) 17 are provided on the front side (lower side in the figure) of the vacuum transfer chamber 10 . A transfer chamber 18 for transferring the semiconductor wafer W in the atmosphere is provided on the front side (lower side in the figure) of these load lock chambers 17 . On the further front side (lower side in the figure) of the transfer chamber 18, a plurality of figure 1 There are three of them) are provided with a loading unit 19 serving as a ...

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Abstract

A substrate processing apparatus has a transfer mechanism arranged on a transfer base and configured to transfer a processing substrate between predetermined transfer positions, a mapping sensor arranged on the transfer base and configured to detect an arrangement state of a processing substrate inside a processing substrate accommodating case which accommodates a plurality of processing substrate in a shelf-like form, and a Z-axis teaching jig provided on or in the vicinity of one of the transfer positions. This substrate processing apparatus detects, by the mapping sensor, a height of the Z-axis teaching jig so as to perform teaching of Z-axis to the transfer mechanism with respect to the one of the transfer positions.

Description

technical field [0001] The present invention relates to a substrate processing apparatus for performing etching processing, film forming processing, etc. on a substrate to be processed, such as a semiconductor wafer or a glass substrate for a liquid crystal display device, and a transfer positioning method thereof. Background technique [0002] Currently, there are known substrate processing apparatuses that perform etching processing, film formation processing, and the like on a substrate to be processed, such as a semiconductor wafer or a glass substrate for a liquid crystal display device. As such a substrate processing apparatus, there is known a structure in which a plurality of vacuum processing chambers (processing chambers), a vacuum transfer chamber provided with a transfer mechanism inside, and a transfer chamber for transferring a substrate to be processed in the atmosphere are known. The chamber, the mounting part equipped with a box body or a front opening unifi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/00
CPCH01L21/67259H01L21/67706
Inventor 近藤圭祐
Owner TOKYO ELECTRON LTD
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