High frequency component

Abstract

The invention relates to a high frequency component with a substrate constructed of a plurality of dielectric layers and, between them, electrode layers having conducting track structures, in which substrate at least one capacitive element and at least one inductive element is formed, whereby at least one arrangement of opposed conducting track 5 structures is provided, these realizing simultaneously a capacitive and an inductive element, whereby the common-mode impedance and the push-pull impedance between the opposing conducting track structures are adjusted to differ by a factor of at least 2.

Description

technical field [0001] The invention relates to a high-frequency component having a substrate consisting of a plurality of dielectric layers, and between which electrode layers have conducting tracts, in which at least one capacitive element and at least one Inductive element. This type of high frequency component is used in wireless circuits. Background technique [0002] The increasing miniaturization of wireless circuits, such as those used in mobile communication devices, requires continued scaling down in order to contain all functions. Modern high-frequency modules use multilayer substrates to increase integration density. Not only the electrical connections between components on the substrate, but also basic electrical functions such as filters are created by proper arrangement of conductive tracks in the substrate. Often, those structures that would consume a large amount of chip area and require appropriate precision can be more economically transferred to the ci...

AI Technical Summary

Problems solved by technology

However, fewer resonators can be used, and the proposed single-layer structure cannot take advantage of the miniaturization possibilities of multilayer substrates

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