Embedded multilayer chip capacitor and printed circuit board having the same

Abstract

The invention provides an embedded multilayer chip capacitor, and a printed circuit board having the same. The embedded multilayer chip capacitor comprises a capacitor body having a plurality of dielectric layers stacked one on another; a plurality of first and second internal electrodes formed inside the capacitor body, separated by the dielectric layers; and first and second vias extended vertically inside the capacitor body. The first via is connected to the first internal electrodes and the second via is connected to the second internal electrodes. The first via is led to a bottom of the capacitor body and the second via is led to a top of the capacitor body.

Description

[0001] related application [0002] This application claims priority from Korean Patent Application No. 2005-0018702 filed with the Korean Intellectual Property Office on Mar. 7, 2005, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to a multilayer chip capacitor. More particularly, the present invention relates to a highly reliable embedded multilayer chip capacitor, and a printed circuit board having the same. Background technique [0004] Due to the high density and integration of electronic circuits, printed circuit boards lack space for mounting passive components. To overcome this, efforts have been made to employ embedded devices or components embedded in the board. In particular, various proposals have been made regarding a method of embedding a capacitor as a capacitive component in a board. In the method of embedding a capacitor in a board, the board itself is used as a dielectric material...

AI Technical Summary

Problems solved by technology

This laser processing significantly increases the manufacturing cost of printed circuit boards

In addition, the small size of the multilayer chip capacitor 10 reduces the accuracy of the laser processing, making it difficult to adequately align the vias

Furthermore, if the circuit board 20 is bent during the manufacture of the printed circuit board 20 with the conventional capacitors 10 embedded therein or in the handling of the manufactured printed circuit board 20, the capacitors inside the board may be subjected to mechanical damage.

That is, as shown in FIG. 2( b ), in case the circuit board 20 is bent, cracks 70 may easily occur in the film capacitor 10, thereby possibly breaking the capacitor 10.

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