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Super-thin plastic key modular and its mfg. method

A manufacturing method and button technology, applied to electrical components, electric switches, circuits, etc., can solve problems such as inconvenience and lack

Active Publication Date: 2006-09-20
SILITECH TECH CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. In injection molding manufacturing, it is necessary to design different plastic molds for thin plates of different thicknesses;
[0006] 2. When positioning thin plates, another positioning fixture must be used for appearance processing; and
[0007] 3. When stamping the thin plate at the end, another stamping machine and the use of stamping fixtures must be used
[0008] Therefore, it can be seen from the above that the above-mentioned existing button module and its use method obviously have inconvenience and lack in actual use, and can be improved.

Method used

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  • Super-thin plastic key modular and its mfg. method
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  • Super-thin plastic key modular and its mfg. method

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Embodiment Construction

[0022] see figure 2 As shown, it is a flow chart of the first embodiment of the manufacturing method of the ultra-thin plastic key module of the present invention. It can be seen from the flowchart that the present invention provides a method for manufacturing an ultra-thin plastic key module, the steps of which include: first, providing a thin plate (S200), wherein the thin plate is made of plastic material, and the thickness of the thin plate is less than or equal to 1 mm; Then, position the thin plate by means of an optical positioning module (S202), wherein the optical positioning module has a photosensitive coupling device (CCD) or complementary metal oxide semiconductor (CMOS) for positioning; then, by means of a computer numerical control (Computer Numerical Control, CNC) equipment to process the thin plate into a predetermined shape (S204).

[0023] Next, set a plurality of graphics or symbols on the back of the thin plate with a predetermined shape (S206), the setti...

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PUM

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Abstract

The method includes following steps: first, supplying a sheet plate; next, positioning the sheet plate by an optical positioning module; then, fabricating the sheet plate to a prearranged shape by computer numerical control (CNC) equipment; setting up a elastic body at lower end of the sheet plate with prearranged shape so as to produce ultrathin key-press body. Advantages are: reducing thickness of module of key-press, not deforming object, or producing cutting raw edge etc. caused by limitation of machine or die designed.

Description

technical field [0001] The invention relates to an ultra-thin plastic key module and a manufacturing method thereof, in particular to an ultra-thin plastic key module through the positioning of an optical positioning module and the processing of computer numerical control (Computer Numerical Control, CNC) equipment. Thin plastic key module and manufacturing method thereof. Background technique [0002] see figure 1 As shown, it is a flow chart of the manufacturing method of the existing button module. It can be seen from the flow chart that the manufacturing method of the existing button module includes: firstly, setting up a predetermined plastic mold (S100); and then, using the plastic mold, forming a thin plate ( S102), wherein the thickness is generally greater than 1 mm; then, provide a fixture for positioning the thin plate (S104); process the appearance of the thin plate (S106), such as setting graphics, symbols on the front or back of the thin plate; then Next, pu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H13/705
Inventor 陈志鸿黄益建练玉燕
Owner SILITECH TECH CORP