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Method and apparatus for aiming at wafer direction using laser

A laser alignment and wafer technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of complex alignment accuracy and low alignment of the crystal orientation method, and achieve high alignment accuracy and simple operation Effect

Inactive Publication Date: 2006-10-11
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to overcome the shortcomings of the existing crystal orientation alignment methods of wafers that are too complicated and the alignment accuracy is not high, and provide a method and device for realizing wafer orientation alignment by using laser

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  • Method and apparatus for aiming at wafer direction using laser

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Embodiment 1

[0040] like figure 1 As shown, the first wafer 3 selects Si epitaxial wafer for use, the crystal orientation is (100), the size is 2 inches, and the thickness is 380 microns, and the (110) cleavage plane is cleaved; the second wafer 4 selects GaAs epitaxial wafer for use, and the crystal To (100), the size is 2 inches, and the thickness is 350 microns, and the (110) cleavage plane is cleaved; the first wafer 3 is fixed on the first five-dimensional adjustment frame 1 by the first sucker 2, and the second wafer 4. The second suction cup 5 is fixed on the second five-dimensional adjustment frame 6, and the two five-dimensional adjustment frames can rotate horizontally, vertically, and three-dimensionally. A five-dimensional adjustment frame makes the bonding surfaces of the first wafer 3 and the second wafer 4 substantially parallel; the first chuck 2 and the second chuck 5 are all selected vacuum chucks; the laser 8 adopts a helium-neon laser, and the spot diameter of the laser...

Embodiment 2

[0046] In order to improve the precision of crystal orientation alignment, on the basis of Embodiment 1, the device further includes a pinhole diaphragm 7 placed in front of the light exit of the laser 8 , and the laser light passes through the pinhole diaphragm 7 . The pinhole aperture 7 uses a self-made pinhole aperture, namely: poke a small pinhole with a diameter of 1mm on a circular thick paper sheet with a diameter of 30mm and a thickness of 0.1mm, and then fix the thick paper sheet on a movable bracket (not shown in the figure). In this embodiment work process, the helium-neon laser is incident on the cleavage surface of the wafer by the aperture diaphragm 7, and the orientation of the wafer is adjusted so that the reflected laser light from the cleavage surface returns by the aperture aperture 7, which can improve Alignment accuracy. The alignment accuracy depends on the length of the optical path of the laser and the pinhole size of the pinhole screen. In this embodi...

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Abstract

The related method for lattice orientation aligning with laser comprises: with a beam of laser to through a small diaphragm into the cleavage surface of the wafer, adjusting the wafer orientation to let the incidence laser reflect through the former diaphragm along the inverse direction of incidence; after adjusting another wafer, moving one wafer slowly to another one for face-to-face nearness for the aligning. This invention is easy to operate precisely for spread in industry.

Description

technical field [0001] The invention relates to a method and a device for aligning crystal orientation of a wafer, in particular to a method and a device for aligning the crystal orientation of a wafer by using a laser. Background technique [0002] When processing multiple wafers, such as bonding, it is often necessary to align the crystal orientations of these wafers. The traditional crystal orientation alignment method usually marks on the wafer to be aligned by photolithography first, and then realizes the crystal orientation alignment by double-sided photolithography. The specific process is: loading the first wafer (referred to as the top wafer), opening Illumination, find the alignment mark by moving or rotating the bottom microscope (BSA, bottom microscope) and the wafer, so that it is in the field of view, and then focus to make the image clear, record the image with a charge-coupled device (CCD) and display it on the monitor Display, lock the microscope and the to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
Inventor 陈良惠郑婉华杨国华何国荣王玉平曹青郭良林学春
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI