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Method of realizing 100nm patterns with transparent no-chromium phase shift mask

A phase-shifting mask and nano-pattern technology, which is applied in the field of optical lithography, can solve the problems of expensive optical lithography equipment and achieve the effect of improving resolution

Active Publication Date: 2006-10-18
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the light source wavelength of optical lithography technology has been shortened to 193nm, the optical lithography equipment using 193nm wavelength light source is very expensive (at 11 million US dollars), and it is difficult for general research institutions to afford such expensive equipment. Research has entered the era of nanotechnology. The research on nanoelectronic devices urgently needs cheap nanofabrication methods. Fully transparent chromium-free phase shift masks can meet this demand.

Method used

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  • Method of realizing 100nm patterns with transparent no-chromium phase shift mask
  • Method of realizing 100nm patterns with transparent no-chromium phase shift mask

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Experimental program
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Effect test

Embodiment

[0056] (1) According to the drawings, data, tapes or disks provided by the user, analyze the data characteristics of the graphic layer of the original layout, and determine the data of the phase-shifting layer.

[0057] (2) Select 200nm as the characteristic size of the phase-shifting layer data, and take out the phase-shifting layer data separately. In order to ensure the overlay of multi-layer graphics, the center point of the phase-shifting layer data is consistent with the original layout graphics.

[0058] (3) Convert the data provided by the user into the data format recognized by the phase-shift mask manufacturing equipment, specifically: if the mask pattern is manufactured using the GCA3600 pattern generator, it will be converted into the GCA3600 format; if it is manufactured using the JBX-6AII electron beam exposure equipment The mask pattern is converted to JEOL51 format.

[0059] (4) Prepare the substrate for preparing the phase-shifting layer mask pattern, select t...

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Abstract

The method of realizing 100 nm pattern with transparent no-chromium phase shift mask has the features of optimized mask pattern data, proper mask pattern exposure process, proper development condition, strictly controlled chromium mask etching condition, post-exposure mask treating process, dry etching phase shifter making process, proper phase shifting layer thickness, etc. and adopts g-line 436 nm wavelength light source in preparing pattern with resolution as high as 100 nm. The method of the present invention has greatly raised exposure resolution of g-line 436 nm wavelength light source without using expensive optical photoetching equipment with 193 nm light source to produce pattern with high resolution through exposure.

Description

technical field [0001] The invention relates to the technical field of optical lithography, and relates to a new method for realizing 100 nanometer pattern processing by using a fully transparent chrome-free phase-shift mask. Background technique [0002] In microelectronics technology, optical lithography has always been the mainstream technology and is widely used in the industry. However, the resolution of optical lithography is affected by the diffraction effect and generally cannot break through the limitation of the wavelength of the optical light source. That is, if the optical light source uses 436nm, then Its lithography resolution is 0.8 micron. Although the light source wavelength of optical lithography technology has been shortened to 193nm, the optical lithography equipment using 193nm wavelength light source is very expensive (at 11 million US dollars), and it is difficult for general research institutions to afford such expensive equipment. Research has enter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20H01L21/027
Inventor 刘明陈宝钦谢常青
Owner SEMICON MFG INT (SHANGHAI) CORP