Flat-face saliant-point type packing base-board for integrated circuit or discrete device

A planar bump type, discrete device technology, applied in the direction of electrical solid devices, semiconductor/solid device manufacturing, circuits, etc., can solve the problem that it is difficult to adapt to the development direction of thin and short packaging products, the overall weight of the chip package increases, and the technical requirements are getting higher and higher. Solve high-level problems to achieve the effect of facilitating technical control, reducing technical harshness, and reducing risks
CN1851915AInactive Publication Date: 2006-10-25JCET GROUP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
JCET GROUP CO LTD
Publication Date
2006-10-25
Estimated Expiration
Not applicable · inactive patent

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Abstract

This invention relates to a plane button package base plate of an IC or a discrete device and its processing method characterizing that base islands and pins are distributed on the front of the base plate in buttons connected by metal thin layers, the base island is the one composed of multiple buttons, the pin is single, the fronts of the islands and the pins have metal layers, the number of the islands is one or many in the package unit of a single IC or discrete device formed in the post package, namely, single unit island or multiple unit base islands composed of multiple buttons, the pins are arrayed at one side, both sides or three sides or surrounding the base islands.
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Description

Technical field:

[0001] The invention relates to a planar bump package substrate for an integrated circuit or a discrete device and a manufacturing method thereof. It belongs to the technical field of electronic components. Background technique:

[0002] In the existing integrated circuit or discrete device planar bump package substrate, the base island on it is in the shape of a whole piece of metal. It mainly has the following deficiencies:

[0003] 1. Packaging structure: Chip base islands correspond one-to-one, and the size of the base island must be larger than the chip size, which has great limitations and is difficult to adapt to chips of different sizes and specifications.

[0004] 2. Packaging reliability: Since the chip is installed on the base island, the requirements for the material, flatness, surface quality, and cleanliness of the base island are extremely high; at the same time, because the entire metal base island is prone to large deformation stress after...

Claims

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