Packaging arrangement of flip chip on thin film

Abstract

The related flip-chip sheet package structure on a film comprises: a flexible base, a flip-chip sheet fixed on top surface of the base and electric connected with the base, and a first thermal fin on the bottom surface o base fit to release heat and increase structure strength.

Description

technical field [0001] The present invention relates to a Flip-chip-on-film package structure, in particular to a Flip-chip-on-film package structure which can effectively dissipate the heat generated during the working process of the flip chip. Background technique [0002] In today's electronic industry, high-efficiency chips are placed on flexible substrates in a flip-chip manner to achieve Chip on film packaging. The Flip-Chip-on-Film packaging structure can be applied to light, thin and short electronic products, such as driver IC chips. However, during the working process of electronic products, the chip will generate heat and it is not easy to dissipate. In addition, during packaging and use, due to insufficient overall strength of the packaging structure, the chip is easily damaged by bending with the flexible substrate, which in turn shortens the service life of the product. [0003] see figure 1 , figure 1 It is a schematic diagram of a conventional flip-chip-o...

AI Technical Summary

Problems solved by technology

[0004] In the flip chip packaging structure 10 on the film, the flip chip 14 will generate heat energy during the working process, and the heat energy is only dissipated from the back side 142 of the flip chip 14, so the best heat dissipation effect cannot be achieved.

In addition, when the flexible substrate 12 is not strong enough to support the flip chip 14 above it, the flip chip 14 will be damaged due to impact during packaging and use.

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