Manil putor automatic silicon-wafer grabbing system and method

A technology of manipulators and silicon wafers, applied in the direction of manipulators, conveyor objects, furnaces, etc., can solve problems such as damage, mass production loss, broken, etc., and achieve the effect of avoiding damage

Inactive Publication Date: 2007-01-10
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this technique is simple and easy to implement, due to the lack of recognition and confirmation of different slots by the manipulator itself, and the deformation of the manipulator, or the wafer b

Method used

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  • Manil putor automatic silicon-wafer grabbing system and method
  • Manil putor automatic silicon-wafer grabbing system and method
  • Manil putor automatic silicon-wafer grabbing system and method

Examples

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Example Embodiment

[0017] Such as figure 2 As shown, a robot automatic silicon wafer pick-and-place system of the present invention includes a silicon wafer box and a manipulator. A light emitter is installed on both sides of the rear end of the silicon wafer portion of the manipulator, and the light emitter may be a separate light emitter. The laser can also be the optical output end of a concentrated laser projection system that is distributed and transmitted through optical fibers. A collimating device corresponding to the light emitter is installed on both sides of the front end of the silicon chip portion of the manipulator. The collimating device is a collimating hole or a collimating slit. Under normal circumstances, the light emitter emits Light can pass through the collimating device. An identification mark is affixed to each groove side of the silicon wafer box, and the identification mark is a diffraction grating array with different codes or a mirror array with different inclination ang...

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Abstract

This invention discloses an automatic taking and laying system for silicon chips of manipulators, which installs light emitters at both sides of the back of a manipulator and an aligning device at the front, sticks identifying signs on each groove side of the silicon chip boxes and sets a photo-detector array on the manipulator. This invention also discloses a method for taking the chips including: the light emitter emits light onto the identifying signs by the aligning device and reflects the identified content onto the photodetector array, after the array detects that the identified content is the same with the identifying signs on the groove sides where the silicon chip to be taken places, the manipulator will take out or put in the chip.

Description

technical field [0001] The invention relates to a system for automatically picking and placing silicon wafers by a manipulator; the invention also relates to a method for automatically picking and placing silicon wafers from a silicon wafer box by using a manipulator. Background technique [0002] With the development of the semiconductor industry, more and more advanced technologies have been applied to this industry. Since the production of integrated circuits and semiconductor devices requires very high cleanliness, many tasks cannot be done manually. Therefore, manipulators are widely used in this field. In the process of picking and placing silicon wafers, the existing robotic wafer automatic pick-and-place system relies on a preset program to stipulate that the manipulator takes the silicon wafer out of the slot of the designated wafer box or puts it into the designated silicon wafer. box, such as figure 1 shown. Although this technique is simple and easy to implem...

Claims

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Application Information

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IPC IPC(8): B65G49/07B65G47/90B25J19/02
Inventor 伍强
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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