Manil putor automatic silicon-wafer grabbing system and method

Abstract

This invention discloses an automatic taking and laying system for silicon chips of manipulators, which installs light emitters at both sides of the back of a manipulator and an aligning device at the front, sticks identifying signs on each groove side of the silicon chip boxes and sets a photo-detector array on the manipulator. This invention also discloses a method for taking the chips including: the light emitter emits light onto the identifying signs by the aligning device and reflects the identified content onto the photodetector array, after the array detects that the identified content is the same with the identifying signs on the groove sides where the silicon chip to be taken places, the manipulator will take out or put in the chip.

Description

technical field [0001] The invention relates to a system for automatically picking and placing silicon wafers by a manipulator; the invention also relates to a method for automatically picking and placing silicon wafers from a silicon wafer box by using a manipulator. Background technique [0002] With the development of the semiconductor industry, more and more advanced technologies have been applied to this industry. Since the production of integrated circuits and semiconductor devices requires very high cleanliness, many tasks cannot be done manually. Therefore, manipulators are widely used in this field. In the process of picking and placing silicon wafers, the existing robotic wafer automatic pick-and-place system relies on a preset program to stipulate that the manipulator takes the silicon wafer out of the slot of the designated wafer box or puts it into the designated silicon wafer. box, such as figure 1 shown. Although this technique is simple and easy to implem...

AI Technical Summary

Problems solved by technology

Although this technique is simple and easy to implement, due to the lack of recognition and confirmation of different slots by the manipulator itself, and the deformation of the manipulator, or the wafer box is not placed properly, the silicon wafer will rub against the slot of the silicon wafer box, and in serious cases, it will be misplaced, even Broken and damaged, with serious losses to mass production

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