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Photosensitive thermosetting resin composition, and photosensitive cover lay and flexible printed wiring board using the composition

A solid resin and composition technology, applied in printed circuit, printed circuit manufacturing, optics, etc., can solve problems such as difficult handling, insufficient flexibility, etc., and achieve adhesion retention, long storage period, and strong adhesion Effect

Active Publication Date: 2007-01-10
ARISAWA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In the photosensitive cover layer formed with the conventional photosensitive thermosetting resin composition, it is difficult to achieve a long shelf life, excellent storage stability at room temperature, solder heat resistance after curing, and strong adhesion
In addition, even if the above characteristics are satisfied, the flexibility after curing may not be sufficient, or handling may be difficult

Method used

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  • Photosensitive thermosetting resin composition, and photosensitive cover lay and flexible printed wiring board using the composition
  • Photosensitive thermosetting resin composition, and photosensitive cover lay and flexible printed wiring board using the composition

Examples

Experimental program
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Embodiment 1～18 and comparative example 1～10

[0100] A photosensitive thermosetting resin composition containing each component in the mixing ratio shown in Table 1 and Table 2 (the unit of the composition amount is parts by weight) was prepared. Then, a photosensitive cover layer provided with a release film is produced on at least one side of a sheet formed by molding the photosensitive thermosetting resin composition into a sheet shape.

[0101] 1) Solder heat resistance test method

[0102] Laminate the photosensitive cover layer (thickness: 25-50 μm) on the copper foil board, carry out UV irradiation, development, heat curing. Then, the soldering fluids were respectively set at 160°C and 288°C, and soaked for 30 seconds respectively. The presence or absence of peeling, swelling, etc. was observed visually. And, the solder heat resistance was evaluated according to the following criteria.

[0103] ◎Immersed at 288℃×30sec, no peeling or swelling

[0104] ○Immersed at 260°C×30sec, there is no peeling and swelling; s...

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Abstract

An object of the present invention is to provide a photosensitive thermosetting resin composition that has a long shelf life and has excellent normal temperature storage stability, has good solder heat resistance after curing, and according to which high adhesive strength can be maintained. The present invention provides a photosensitive thermosetting resin composition containing a photosensitive prepolymer, a photosensitive monomer, a thermosetting resin, a curing agent, and a polymerization initiator, the photosensitive thermosetting resin composition containing (A) a carboxylic acid-modified bisphenol type epoxy (meth)acrylate as the photosensitive prepolymer.

Description

technical field [0001] The present invention relates to a photosensitive thermosetting resin composition which has a long storage period (usable period), excellent storage stability at room temperature, has solder heat resistance after curing, and can maintain strong adhesion, and a photosensitive cover layer using the composition and Flexible printed circuit boards. Background technique [0002] Conventionally, various technologies related to a photosensitive cover layer (photosensitive dry film), a photosensitive thermosetting resin composition for forming the photosensitive cover layer, and the like have been proposed. [0003] For example, Japanese Unexamined Patent Publication No. 2005-62450 discloses a photosensitive thermosetting resin composition for resist ink which is excellent in bending resistance (flexibility) of a cured product (Patent Document 1). Specifically, it is a compound containing (A) specific carboxy-modified epoxy (meth)acrylic resin, (B) biphenyl t...

Claims

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Application Information

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IPC IPC(8): G03F7/027H05K1/00
CPCH05K3/287H05K1/0393G03F7/027G03F7/038G03F7/0045
Inventor 长谷川慎一植木徹
Owner ARISAWA MFG CO LTD
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