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LED packaging structure with thermoelectric device

A technology for light emitting diodes and thermoelectric devices, which is applied in the fields of electric solid state devices, electrical components, semiconductor devices, etc., and can solve problems such as limited heat dissipation efficiency.

Inactive Publication Date: 2007-01-31
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method uses an external thermoelectric device in the package structure, and its heat dissipation efficiency is very limited

Method used

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  • LED packaging structure with thermoelectric device
  • LED packaging structure with thermoelectric device
  • LED packaging structure with thermoelectric device

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Embodiment Construction

[0038] Figure 5 The LED packaging structure with thermoelectric devices provided by the first embodiment of the present invention includes LED units 30 , insulating layer 40 , substrate 50 , solder bump layer 60 and two sets of thermoelectric devices 70 .

[0039] The light-emitting diode unit 30 of this embodiment is formed on a sapphire substrate (Sapphire) 31 by growing a p-type light-emitting layer 32, an active layer (ActiveLayer) 33, an n-type light-emitting layer 34, a p-type contact layer 35, and an n-type contact layer 36. and made, and the p-type light-emitting layer 32 is arranged on the sapphire substrate 31, the active layer 33 and the p-type contact layer 35 are arranged on the p-type light-emitting layer 32, the n-type light-emitting layer 34 is arranged on the active layer 33, and the n-type contact layer The layer 36 is arranged on the n-type light-emitting layer 34, and the p-type contact layer 35 and the n-type contact layer 36 are respectively connected to...

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Abstract

The invention discloses a LED packing structure with thermoelectric device, applied to LEDs to be packed in flip-chip welding mode, mainly making the thermoelectric device in a solder ball bump layer of the LED packing structure to replace a part of solder ball bumps so as to effectively raise the heat radiating efficiency of LED cell and thus improve lighting stability and reliability and reduce the difficulty and complexity in integrated LED packing.

Description

technical field [0001] The invention relates to a packaging structure of a light emitting diode, which is applied to a light emitting diode packaged in a flip-chip welding manner, in particular to a packaging structure of a light emitting diode with a thermoelectric device that can increase the heat dissipation capacity of the packaging of the light emitting diode. Background technique [0002] Light-emitting diode (Lighting Emitting Diodes; LED) is a kind of light-emitting device composed of semiconductor materials, which uses the combination of electrons and holes in the semiconductor to emit photons and generate spectrums of different frequencies. Mercury, long life and power saving, etc., so it has gradually received attention in applications such as lighting and display backlight. However, as the luminance of light-emitting diodes increases, the heat generated per unit area also increases, making the heat density continue to increase. The method and heat dissipation me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L23/38H01L33/48H01L33/64
CPCH01L2924/0002H01L2924/15311H01L2224/48091H01L2224/16225H01L2224/48227
Inventor 余致广刘君恺谭瑞敏郑仁豪
Owner IND TECH RES INST