(111) silicon based micro mechanical acceleration sensor and its manufacture

Abstract

The invention relates to a micro mechanical acceleration sensor based on (111) silicon, and relative production, wherein said sensor is formed by one (111) single crystal silicon substrate and upper and lower substrates; the inertia quality of silicon substrate via at least one couple of flexible suspension beams of one substrate is connected to the fixed frame, to vertically move relative to the substrate via external acceleration, and change the capacitor between the plate electrodes of upper and lower substrates, to detect external acceleration. Said flexible suspension beams are symmetry relative to the (111) silicon substrate, while its size control and production are based on silicon chemical aeolotropism corrosion and height-depth-width ratio dry method etching technique; the (111) silicon substrate and upper and lower substrates are bonded by align bonds. The inventive sensor can realize closed detection, with controllable technique, high accuracy and the application with multi-axle integration.

Description

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AI Technical Summary

Benefits of technology

This patented technology describes different embodiments for improving the design of accelerometer systems that include both sensitive elements made from silicon alone and more advanced materials like glassy plasma blocks. These improvements make them easier to produce while maintaining their desired properties. They also allow for precise measurement without any misalignment during assembly, reducing costs associated therewith. Overall these technical results help create better quality products for various applications including oil drilling operations.

Problems solved by technology

This technical problem addressed in this patents relates to complex processes involved during producing high performance MEMS sensors used in various industries such as defense industry or civil engineering. Existing techniques involve opening loops and closing loops, which require precise alignment and assembly steps, leading to increased costs and instabilities over time. Therefore, new solutions must overcome issues associated with existing technologies like those described earlier.

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