Packaging structure for optical sensing module

A technology of light sensing module and packaging structure, applied in radiation control devices and other directions, can solve problems such as appearance deformation, clean particle pollution, process yield and quality impact, etc.

Inactive Publication Date: 2007-02-28
SIGURD MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since most of the current lenses are plastic lenses (Plastic Len(s)), it cannot allow the electrical bonding of the printed circuit board in a high-temperature process environment. If the lens barrel 15 is installed on the lens holder 10 first, and then the SMT process is performed, The appearance of plastic lenses may be deformed due to the above-mentioned high-temperature environmental process, which will cause optical imaging problems
[0004] Therefore, the lens barrel 15 must be i...

Method used

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  • Packaging structure for optical sensing module
  • Packaging structure for optical sensing module
  • Packaging structure for optical sensing module

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Embodiment Construction

[0038] As shown in FIG. 2 , the packaging structure of the photo-sensing module provided by the embodiment of the present invention mainly includes a substrate 100 , a molded body 110 , a photo-sensing chip 120 , a lens holder 130 and a lens barrel 140 . Several metal wires 101 are disposed on the surface of the substrate 100. The molded body 110 is installed on the substrate 100 to form a cavity 111. The photosensitive chip 120 is installed in the cavity 111 and electrically connected to the substrate 100 through the metal wires 101. and the lens barrel 140 includes a lens 141 and a through hole 142, the through hole 142 is penetrated at the center line of the lens barrel 140 to transmit the light source, the lens 141 can receive the light source through the through hole 142, focus and transmit the light source As far as the light sensing chip 120 is concerned, the mirror base 130 is a hollow body with both ends transparent, it is installed above the forming body 110, and the ...

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Abstract

The invention relates to a package of light-sensitive module, which processes the electric connection of light-sensitive chip and the installment of lens base and cylinder, to avoid the effect of external contaminant; in addition, designs the opposite surface between lens base and cylinder into smooth surface, to avoid accumulating contaminant, improve yield and reduce the cost.

Description

technical field [0001] The present invention relates to a package structure of a photo-sensing module, in particular to a package structure of a photo-sensing module that can improve production yield. Background technique [0002] As shown in FIG. 1 , the packaging structure of a traditional photo-sensing module is that a flange layer 11 and a cavity 12 are formed on an injection-molded mirror base 10, and then a photo-sensing chip 13 is placed in the cavity 12, and the cavity A light-transmitting layer 14 is placed on the hole 12, and the flange layer 11 is an internal thread type, which is provided for a lens barrel 15 corresponding to an external thread. The lens barrel 15 includes a through hole 16, an aspheric lens 17 and an infrared filter. In addition, the optical lens 18 is encapsulated in the cavity 12 by the encapsulant 19 and covers the light sensing chip 13 . [0003] In the known packaging structure, the surface mount technology (SMT, hereinafter only abbreviat...

Claims

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Application Information

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IPC IPC(8): H01L27/146
Inventor 陈柏宏陈懋荣
Owner SIGURD MICROELECTRONICS CORP
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