Packaging structure for optical sensing module

Abstract

The invention relates to a package of light-sensitive module, which processes the electric connection of light-sensitive chip and the installment of lens base and cylinder, to avoid the effect of external contaminant; in addition, designs the opposite surface between lens base and cylinder into smooth surface, to avoid accumulating contaminant, improve yield and reduce the cost.

Description

technical field [0001] The present invention relates to a package structure of a photo-sensing module, in particular to a package structure of a photo-sensing module that can improve production yield. Background technique [0002] As shown in FIG. 1 , the packaging structure of a traditional photo-sensing module is that a flange layer 11 and a cavity 12 are formed on an injection-molded mirror base 10, and then a photo-sensing chip 13 is placed in the cavity 12, and the cavity A light-transmitting layer 14 is placed on the hole 12, and the flange layer 11 is an internal thread type, which is provided for a lens barrel 15 corresponding to an external thread. The lens barrel 15 includes a through hole 16, an aspheric lens 17 and an infrared filter. In addition, the optical lens 18 is encapsulated in the cavity 12 by the encapsulant 19 and covers the light sensing chip 13 . [0003] In the known packaging structure, the surface mount technology (SMT, hereinafter only abbreviat...

AI Technical Summary

Problems solved by technology

Since most of the current lenses are plastic lenses (Plastic Len(s)), it cannot allow the electrical bonding of the printed circuit board in a high-temperature process environment. If the lens barrel 15 is installed on the lens holder 10 first, and then the SMT process is performed, The appearance of plastic lenses may be deformed due to the above-mentioned high-temperature environmental process, which will cause optical imaging problems

[0004] Therefore, the lens barrel 15 must be installed after the SMT process; however, the SMT process is not a process carried out in a clean room environment, that is to say, the known technology must utilize a clean process (Cleaning Process) to remove the SMT process. The particle pollution caused, and for the structure of the mirror holder 15 with the flange layer 11 of the thread type, it may not be easy to achieve real clean particle pollution, so that the process yield (process yield) and quality (quality) ) will be affected

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