Polyimide polymer for preparing copper-cover laminated plate and preparation method thereof

A technology of laminates and polyamic acid, applied in the fields of coating, liquid chemical plating, printed circuit manufacturing, etc., can solve the problems of inconvenience, unsuitable products and manufacturing methods, etc., and achieve the best tear resistance, good Effect of Dimensional Stability

Inactive Publication Date: 2007-03-07
THINFLEX CORP
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  • Abstract
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Problems solved by technology

[0008] This shows that above-mentioned existing polyimide polymer and preparation method thereof obviously still have inconvenience and defect in product, manufacturing method and use, and urgently need to be further improved
In order to solve the problems existing in polyimide polymers and their preparation methods, relevant manufacturers have tried their best to seek solutions, but for a long time no suitable design has been developed, and general products and manufacturing methods have not been suitable. All methods can solve the above problems, which is obviously a problem that the relevant industry is eager to solve

Method used

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  • Polyimide polymer for preparing copper-cover laminated plate and preparation method thereof
  • Polyimide polymer for preparing copper-cover laminated plate and preparation method thereof

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Embodiment Construction

[0022] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the polyimide polymer used for preparing copper-clad laminates proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Its specific embodiment, manufacturing method, steps, characteristics and effect thereof of preparation method thereof are described in detail as follows.

[0023] The preparation of polyimide polymer of the present invention is that aromatic tetracarboxylic dianhydride and aromatic diamine are dissolved in polar aprotic solvent and react to generate polyamic acid solution, and polyamic acid solution undergoes heat treatment and imide Forming a heat-resistant polyimide polymer, without adding any inorganic fillers, adjusting the molar ratio of various aromatic tetracarboxylic dianhydrides or various aromatic diamines in the polyamic acid ...

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Abstract

The invention discloses a polyimide polymer and preparing method of clad copper layer board, which comprises the following steps: dissolving aromatic tetracarboxylic dianhydride and aromatic diamine in the polar aprotic solvent without adding inorganic filler; producing polyamide acid solution; proceeding amination reaction for polyamide acid solution to obtain the product with heat bulking coefficient between 10 and 30pm/deg.c.

Description

technical field [0001] The present invention relates to a polyimide polymer and a preparation method thereof, and in particular to a polyimide polymer for preparing copper-clad laminates and a preparation method thereof. Background technique [0002] Flexible printed circuit boards have been widely used in consumer electronics products such as notebook computers, mobile phones, personal digital assistants and digital cameras. Towards the use of lighter and thinner adhesive-free polyimide copper clad laminates. [0003] According to whether there is an adhesive layer between the polyimide layer and the copper foil, polyimide flexible printed circuit boards can be divided into adhesive and non-adhesive types. Generally speaking, polyimide polymers do not have good adhesion to copper foil, so polyimide flexible printed circuit boards with glue will use epoxy resin between the polyimide mold layer and copper foil. Or acrylic resin is used as the adhesive layer to fix it, while...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/02H05K3/00
Inventor 王美雁郭培荣张家煌丘建华
Owner THINFLEX CORP
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