Oxygen concentration determination apparatus
A technology for measuring devices and oxygen concentration, applied in measuring devices, material analysis by electromagnetic means, instruments, etc., can solve the problems of response delay, loss of oxygen sensor, and inability to move electrons, etc., and achieve the effect of improving responsiveness and extending life
Inactive Publication Date: 2007-04-04
TORAY ENG CO LTD
View PDF2 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] In the case of such an oxygen sensor, if the platinum electrode comes into contact with impurities contained in the measurement gas, the impurities will adhere to the platinum electrode, and the movement of oxygen molecules, that is, the movement of electrons will proceed smoothly, causing a response delay in a short time Phenomenon, eventually unable to move electrons, lose the function of oxygen sensor
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0028] FIG. 1 is a component diagram showing an example of an oxygen concentration measuring device of the present invention, in which a measuring unit 1 is provided.
[0029] The measurement unit 1 includes: a suction pump 4 that sucks the gas to be measured from a suction port 7 through a filter 8 that removes dust from the gas to be measured; a solid electrolyte oxygen sensor (hereinafter referred to as an oxygen sensor) 3 for measuring the oxygen concentration; and a removal unit. 2. It is located upstream of the oxygen sensor 3 , and removes substances that degrade the oxygen sensor from the gas to be measured by the suction pump 4 , and sends the gas to be measured into the oxygen sensor 3 .
[0030] In addition, a flow meter 9 for measuring the flow rate of the gas to be measured after measuring the oxygen concentration in the oxygen sensor 3 and a gas discharge port 12 for discharging the gas to be measured that has passed through the flow meter 9 to the outside of the ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
An oxygen concentration measuring apparatus capable of removing substances which degenerate an oxygen sensor in gases to be measured before the gases to be measured reach the oxygen sensor and enabling the oxygen sensor to measure the concentration of oxygen without the substances which degenerate the oxygen sensor. The oxygen concentration measuring apparatus comprises a suction pump 4 for sucking the gases to be measured from a suction opening 7; an oxygen sensor 3 for measuring the concentration of oxygen; and a removal unit 2, located at the upstream of the oxygen sensor 3, for removing substances which degenerate the oxygen sensor from the gases to be measured which are fed in from the suction pump 4, and feeding the gases to be measured to the oxygen sensor 3.
Description
technical field [0001] The present invention relates to an oxygen concentration measuring device for monitoring and controlling the oxygen concentration in soldering equipment, semiconductor manufacturing equipment, and the like. Background technique [0002] In a soldering apparatus or the like, the wettability of the solder decreases due to oxidation of the solder due to oxygen, and a soldering failure may occur. Therefore, in order to prevent the above soldering failure, an oxygen concentration measuring device is usually used to monitor and control the oxygen concentration in the soldering atmosphere within a predetermined value (for example, 100 ppm) that does not affect the solder. [0003] In addition, in semiconductor manufacturing equipment and the like, the processing of silicon wafers in the semiconductor manufacturing process is often performed in an oxygen-free state (for example, CVD, firing, annealing, etc.). However, if there is a heating process in the proc...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): G01N27/409G01N27/26
CPCG01N27/4065G01N27/409G01N27/4162G01N27/4175G01N27/419
Inventor 权并英明大西隆文西川隆也
Owner TORAY ENG CO LTD