Heat sink

Abstract

A heat-radiating device arranges for cooling the electronic component. The heat-radiating device comprises a baseboard, at lease two heat-conduction pipes, and a radiating fins module. One surface of the baseboard has the grooves suited the heat-conduction pipes, and the other surface contacts the electronic component. The radiating fins module is arranged vertically on the baseboard, the module comprising multiple radiating fins parallel arranged, and forms the flow passage structure with the middle fins dense and the two-side fins sparse for the middle fins locating just on the top of heat source. It can increase the heat-radiating area that heat source region adopts the dense structure, and it can decrease the wind resistance that the two-side adopts the sparse structure, and air stream can take out heat quantity in time. Hence, compared with traditional heat-radiating devices, the performance of the invention improves preferable.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device applied to electronic components. 【Background technique】 [0002] Electronic components (such as central processing unit) generate a lot of heat during operation, which increases the temperature of itself and the system, which in turn leads to a decrease in its operating performance. In order to ensure the normal operation of the electronic components, a cooling device is usually installed on the electronic components to dissipate the heat generated by them. [0003] A traditional cooling device generally includes a bottom plate in contact with electronic components, a plurality of heat sinks arranged on the bottom plate, and a fan installed on the top or side of the heat sink. The heat generated by the operation of electronic components is absorbed by the bottom plate, and then dissipated to the surrounding environment through the heat sink to cool the el...

AI Technical Summary

Problems solved by technology

However, increasing the heat sink density can increase the total heat dissipation area, but due to the denser structure of the heat sink, the wind resistance is greater, and most of the energy of the flowing gas is consumed by the stagnant flow generated by the narrow flow channel, resulting in airflow The heat cannot be blown into the fin group or the flow rate is slow, so the heat cannot be taken away in time, causing the temperature of the surrounding environment to rise, which seriously affects the heat dissipation efficiency of the heat sink; , to ensure the smoothness of the flow path, but due to the small heat dissipation area of ​​the heat dissipation device, the heat that can be exported is small, and the purpose of cooling electronic components cannot be achieved

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