Paster diode with new structure and producing method thereof

Abstract

A method for preparing paster diode includes setting thick and thin copper plates with the same length to be parallel-interval way, welding diode chip on thin copper plate and connection copper plate between diode chip and top plane of thick copper plate, enveloping three said copper plates and diode chip in epoxy body, making bottom surfaces and two end surfaces of thick and thin copper plates be at the same plane with bottom surface and two end surfaces of epoxy body.

Description

technical field [0001] The invention relates to a new structure patch diode and a manufacturing method thereof. Background technique [0002] In the electronics industry, diodes have become the basic components of various electronic products. Traditional diode products have a lead wire at both ends. When using it, it is necessary to drill a hole on the circuit board and pass the lead wire through the hole made on the circuit board. The product is fixed on the circuit board. However, the current electronic products used all over the world, such as telephones, televisions, fax machines, computers and their peripheral products, are all developed with the goal of being thin, light and small. The circuit board technology mostly uses double-layer or multi-layer Multi-layer circuit board technology, but double-layer or multi-layer circuit boards cannot punch holes in the circuit board, so circuit boards with more than two layers use SMD electronic components. For example, chip res...

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Problems solved by technology

[0006] (1) The forming mold wastes space, there must be a gap between the blanks, and the molding efficiency is poor;

[0007] (2) Both sides of the material sheet must be removed to form Figure 6, the copper sheets on both sides are wasted, the utilization rate of the copper sheets is less than 20%, and the rest is wasted;

[0008] (3) When molding, it needs to go through the middle rubber channel and then shoot to both sides, waste the rubber channel and inject into the diode guides on both sides, the epoxy resin usage rate is less than 30%, and the rest is wasted, because the epoxy resin cannot be recycled, causing environmental pollution

[0011] (1) The leads on both sides should be cut off to waste the copper leads. In fact, the utilization rate of the copper leads is 20%, and the rest should be used as waste;

[0012] (2) The design of the molding die is shown in Figure 9, because the copper leads on both sides waste space and the efficiency is low;

[0013] (3) After molding, in order to make the following process easy to operate, two glue lines must be added to both sides of the copper lead wire during epoxy resin molding to fix the copper leads on both sides and then cut off, and the glue roads on both sides are wasted, and the actual epoxy resin usage rate is also low. Less than 20%, waste epoxy resin is not easy to handle, causing environmental pollution

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