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Paste coater and PoP automatic mounting apparatus employing the same

A technology of automatic installation and paste coating machine, which can be used in devices for coating liquid on surfaces, welding equipment, metal processing equipment, etc., and can solve the problem of not being able to optimally adjust the gap.

Inactive Publication Date: 2007-06-20
INT BUSINESS MASCH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since this scraper is fixed to the container, the gap cannot be optimally adjusted due to the pitch and diameter of the conductive balls

Method used

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  • Paste coater and PoP automatic mounting apparatus employing the same
  • Paste coater and PoP automatic mounting apparatus employing the same
  • Paste coater and PoP automatic mounting apparatus employing the same

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Embodiment Construction

[0064] Preferred embodiments of the present invention will be described in detail below while referring to the accompanying drawings. The same reference numerals are used to denote the same or corresponding parts, and explanation thereof will not be repeated.

[0065] PoP automatic installation equipment

[0066]Referring to Fig. 1, the PoP automatic mounting equipment 10 according to this embodiment assembles a semiconductor package, such as BGA, CSP or flip chip, on top of another semiconductor package, and includes: an upper tray 11, a lower tray 12, a suction nozzle 13 to 15. Nozzle conveying mechanism 16 to 18, position correction unit 19, pasting machine (including sliding mechanism) 20, inverted extraction unit 21, position lighting and vertical identical observation camera optical system 22, alignment color monitor 23 and controller 24 .

[0067] A plurality of upper semiconductor packages 25 are arranged on the upper tray 11 , and a plurality of lower semiconductor ...

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PUM

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Abstract

A paste coater that can apply an amount of a solder paste to small-diameter bump electrodes at a narrow pitch is described. A paste coater includes: a transfer roller, supported by a sub frame; a roller drive mechanism for rotating the transfer roller; a paste storage unit for storing paste to be supplied to the surface of the transfer roller; a squeegee having a distal edge, parallel to the rotary shaft of the transfer roller, separated by a gap from the distal edge to the surface of the transfer roller; a squeegee holder for holding and including biasing means for pushing the squeegee in a first direction thereby widening the gap; and a gap adjustment mechanism with biasing means for pushing the squeegee in a second direction thereby narrowing the gap.

Description

technical field [0001] The present invention relates to a paste applicator and PoP (Package on Package) automatic mounting equipment using the paste applicator. More particularly, the present invention relates to a paste applicator for applying solder paste to ball electrodes of semiconductor packages such as ball grid arrays, chip scale packages, and flip chips; and a machine for mounting one semiconductor package on top of another PoP automatically installs devices. Background technique [0002] Semiconductor packages, such as BGAs, include an array of protruding ball electrodes. To mount a semiconductor package to the front side of a printed circuit board, solder paste is traditionally pre-applied to the ball electrodes of the semiconductor package, or printed circuit on the wiring pattern of the board. [0003] In the disk squeegee method, a disk coated with solder paste is rotated and the paste is leveled with a squeegee, and then solder paste is applied to the ball ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C1/08B05C13/02B23K3/08H01L21/67
CPCH05K2201/035H01L2924/01015H05K3/1275H01L2224/758H05K2203/0534H05K2203/0139H01L2924/01082H05K2203/0143H05K2201/10734H01L2224/136H01L2924/01005H01L2924/01033H01L2924/01006H05K3/3484H01L2224/13099H01L2224/75H01L2924/01075H01L24/11H01L2924/014H01L2924/01013H01L24/75H01L2924/3025H01L2224/7515H01L2224/11822H05K3/3485
Inventor 木村英夫横上利之盐田靖彦
Owner INT BUSINESS MASCH CORP
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