72results about "Offset printing" patented technology

An apparatus and method for making a printed circuit board comprising a substrate and an electrical circuit is provided. The circuit is formed by deposition of a plurality of electronic inks onto the substrate and curing of each of the electronic inks. The deposition may be performed using an ink-jet printing process. The inkjet printing process may include the step of printing a plurality of layers, wherein a first layer includes at least one electronic ink deposited directly onto the substrate, and wherein each subsequent layer includes at least one electronic ink deposited on top of at least a portion of a previous layer when the previous layer has been cured. One or more of the layers may include at least two of the electronic inks.

Wirings 2B1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent property, bonding an insulating layer 4B1 to the wirings 2B1 with an adhesive material 3B1 therebetween, peeling and removing the provisional substrate 5, and bonding and fixing the wirings 2B1 together with the insulating film 4B1 to a main substrate 1 by an adhesive material 3B1.

A method of manufacturing a thin film device according to an aspect of the invention may include: forming a sacrificial layer on a first substrate; forming a thin film on the sacrificial layer, the thin film being an object of transfer; temporarily bonding a support structure to the thin film; removing the sacrificial layer to separate the thin film from the first substrate; bonding the thin film, temporarily bonded to the support structure, to a second substrate; and separating the support structure from the thin film.

Methods and apparatus for generating and performing digital communications using a randomized generatable interleaver. In accordance with one exemplary embodiment of the invention, a pseudo random interleaver of size n*m with excellent randomness and spread properties may be generated from a set of seed values. The interleaver of size N=n*m is defined by dividing the N possible address in the interleaver (0-N−1) into n subsets. The subsets are preferably generatable from a single value within the subset either using an algorithm or a memory based lookup table. The set of n seeds comprises one value selected from each subset. An improved communication system incorporating the aforementioned interleaver and using turbo codes or other concatenated coding systems is also disclosed.

The present invention discloses an apparatus for manufacturing electronic devices using a roll-to-roll rotary pressing process, comprising a winding roll around which flexible printing paper is wound; a plurality of printing units arranged in a straight line; at least one coating unit; a rewinding roll to rewind the printing paper when printing has been completed; a plurality of guide rolls arranged between the winding roll and the rewinding roll, thus guiding the printing paper; a plurality of drying units, each drying unit being provided on a printing paper-path between the printing unit and the adjacent guide roll to dry ink transferred to the printing paper or on a printing paper-path between the coating unit and the adjacent guide roll to dry the printing paper on which coating agent is supplied; and tension regulating units installed around the winding roll and the rewinding roll, respectively, for regulating tension of the printing paper.

A stretchable circuit board includes plural stretchable bases, and plural stretchable wiring portions, at least one of which is provided on each of main surfaces, facing each other, of the plural stretchable bases, in which the stretchable wiring portions provided on the main surfaces are electrically continuous with each other through a connecting portion.

A printing plate for reversed relief offset printing ensures the prevention of the internal omission of a desired pattern without increasing the depths of depressions of the plate. The printing plate comprises a base material having depressions and a non-depressed part on a surface thereof, and ink repellent layers that cover inner surfaces of the depressions, respectively. The depressions of the base material whose inner surfaces are respectively covered with the ink repellent layers have a plan shape that defines a desired pattern. The non-depressed part of the base material is formed in such a way that a part of an ink film corresponding to the non-depressed part can be transferred to the printing plate in a process of reversed relief offset printing. The parts of the ink film corresponding to the depressions are not transferred to the printing plate due to the repelling action of the ink repellent layers.

The present invention relates to a method and an arrangement for transferring a conductive picture (12) to an irregular surface of a mobile phone casing (4) for shielding the mobile phone casing from electromagnetic radiation. It also relates to the printing color used for the conductive picture and tampon pads (5) used for the transferring of the conductive printing color to the phone casing (4). Conductive partial pictures (7) are printed on the irregular surface of the casing (4) step by step by means of tampon pads until the complete conductive picture (12) is achieved. The tampon pad has a shape corresponding to the surface of the phone casing. The printing color has a composition, which facilitates the adhering on the tampon pad. The invention also describes a method for printing an electric circuit pattern on a phone casing (4) by using the above mentioned tampon pads and printing color.

In a method for the manufacture of a printed circuit on a dielectric carrier (2), in a first step a circuit pattern (1) is applied with an electrically conductive ink and, in a second step, the circuit model is plated, the electrically conductive ink being applied by means of a method of gravure printing and the plating being done by electrolytic or chemical means.

A method of manufacturing a metal film pattern forming body, the method including: forming a desired metal film pattern on one surface of a stamp by using a catalyst for activating a surface of a plastic base; activating the surface of the plastic base by transferring the catalyst formed on the surface of the stamp onto the surface of the plastic base; and plating the surface of the activated plastic base.