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Method for producing ceramic substrate

A manufacturing method and technology of ceramic substrates, which are applied in the direction of improving the metal adhesion of insulating substrates, manufacturing printed circuits, and manufacturing multilayer circuits, etc., and can solve problems such as the adhesive layer cannot be covered, the adhesion is insufficient, and peeling off

Inactive Publication Date: 2002-11-20
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, the process of directly replicating the conductor pattern on the GS by the thick film gravure replication method needs to be coated on the GS with an adhesive layer mainly composed of thermoplastic resin, but the adhesive layer dissolves in an organic solvent, and the adhesive layer cannot be covered.
In addition, when unsintered GS is laminated on a sintered ceramic substrate, the adhesion between the two sides is insufficient, resulting in debonding during hot pressing, delamination during sintering, and delamination during sintering.

Method used

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  • Method for producing ceramic substrate
  • Method for producing ceramic substrate
  • Method for producing ceramic substrate

Examples

Experimental program
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Embodiment 1

[0062] Example 1 will be described with reference to FIG. 1 . In the thick-film gravure copying, a heat-resistant film such as polyimide is used for the gravure.

[0063] This film is machined with grooves as a conductor pattern by a stimulated complex laser, thereby forming a gravure film. This relief film is peeled off so that it can be easily peeled off during gravure copying. Use a rigid scraper to fill the conductor pattern groove with conductor paste for the film groove. Conductor paste adopts silver-based paste that can be fired to 850°C to 900°C. The gravure film filled with the paste is dried in a dryer at 100°C to 150°C for 5 to 10 minutes. The conductor paste filled into the grooves reduces in volume due to evaporation of the solvent in the paste after drying. In order to make the concavity of the dry surface of the conductive paste on the unprocessed side of the gravure film less than 5 μm, the conductive paste should be repeatedly filled and dried.

[0064] T...

Embodiment 2

[0068] Embodiment 2 will be described based on FIG. 2 . Two or more unsintered ceramic green sheets obtained by re-transferring by the thick-film gravure replication method in Example 1 were stacked and integrated by hot pressing. The hot pressing temperature at this time needs to be higher than the softening temperature of the adhesive layer and lower than the critical temperature (about 100° C.) at which the GS does not thermally deform. The hot-pressing pressure is about 50-100kg / cm2, and the hot-pressing time is about 3-10 minutes, but it can be adjusted according to the laminated state so that the laminated part does not peel off.

[0069] Secondly, by debonding and sintering this GS, ceramic multilayer circuit boards with high-density conductor patterns can be manufactured.

Embodiment 3

[0071] Embodiment 3 will be described based on FIG. 3 . Through-holes were formed in green ceramic green sheets (hereinafter abbreviated as GS) before re-replication by the thick-film gravure replication method in Example 1 using a punching device or the like. Fill the conductive paste on the through hole with a metal plate by screen printing, and dry it at a temperature (60-100°C) that does not deform the GS. Then, as in Example 1, the heat-resistant substrate temporarily filled with the conductor paste and the GS on which the via-hole conductors were formed were hot-pressed, and the conductor paste was transferred to the side of the GS on which the via-hole conductors were to be formed. Then, the heat-resistant substrate is peeled off, and GS with conductive patterns and through-hole conductors formed by the gravure film can be manufactured. In this way, a ceramic circuit substrate having a high-density conductor pattern connected by interlayer via holes can be manufactured...

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Abstract

Provided is a method for manufacturing a ceramic circuit substrate in which a high-density pattern obtained by a thick-film gravure (11) replication method is used as an inner layer conductor. The adhesive (14) is coated on the heat-resistant substrate (13), and the conductor pattern (12) is temporarily copied on the heat-resistant substrate. A green sheet (15) is laminated on the conductor pattern side of the heat-resistant substrate and heated and compressed, whereby the conductor pattern is reproduced on the green ceramic green sheet and cut into the green sheet. A conductor pattern is thus formed on the green sheet. After the green sheet and the pattern are debonded and sintered, a ceramic circuit board with a high-density pattern obtained by the thick film gravure replication method as the inner layer conductor can be manufactured.

Description

technical field [0001] The present invention relates to a method for manufacturing a ceramic substrate. Background technique [0002] In recent years, ceramic multilayer circuit boards have become the mainstream of low-temperature firing boards (LTC), and are used in small components such as personal computers and mobile phones. These ceramic multilayer circuit boards are generally manufactured from green ceramic green sheets (hereinafter referred to as GS) by a GS lamination method. [0003] In the formation method of the conductor wiring part, screen printing is generally used for the inner layer conductor, and screen printing, thin film photolithography, and thick film photolithography are known for the outer conductor wiring part. [0004] As embodied in mobile phones and the like, electronic components are required to be extremely light, thin, and compact. The printed circuit board has been developed into an LCR composite circuit board with built-in inductor elements,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L21/68H01L23/498H01L23/538H05K1/09H05K3/20H05K3/38H05K3/46
CPCH01L21/4857H01L21/486H01L21/4867H01L21/568H01L21/6835H01L23/49822H01L23/5383H01L2221/68345H01L2924/09701H01L2924/19041H05K1/092H05K3/1275H05K3/207H05K3/386H05K3/4611H05K3/4629H05K2201/0376H05K2203/0113H05K2203/0534H01L2924/0002H01L2924/00
Inventor 桥本晃
Owner PANASONIC CORP
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