Semiconductor device
a technology of semiconductor modules and semiconductors, applied in semiconductor devices, semiconductor/solid-state device details, cooling/ventilation/heating modifications, etc., can solve the problems of increasing cost, increasing size, and increasing cost, so as to reduce the occupied area and improve heat radiation performan
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first preferred embodiment
[0033]A semiconductor device according to a first preferred embodiment will be described.
[0034](Device Configuration)
[0035]FIG. 1 is a cross-sectional view illustrating a configuration of a semiconductor device 100 according to the first preferred embodiment. The semiconductor device 100 includes a printed wiring board 10, a first semiconductor module 20, a first heat radiator 40, a second semiconductor module 30, and a second heat radiator 50. Although described in detail below, in the first preferred embodiment, the semiconductor device 100 is a power semiconductor device including power semiconductor modules as the first semiconductor module 20 and the second semiconductor module 30.
[0036]The printed wiring board 10 is provided with a plurality of terminal parts 12 or a plurality of wires (not illustrated) for connecting the first semiconductor module 20 and the second semiconductor module 30 in parallel.
[0037]The first semiconductor module 20 includes a first package body 22, a ...
second preferred embodiment
[0065]A semiconductor device according to a second preferred embodiment will be described. Note that description of the same configuration and operation as those in the first preferred embodiment will be omitted.
[0066]FIG. 11 is a cross-sectional view illustrating a configuration of a semiconductor device 101 according to the second preferred embodiment. FIG. 12 is a plan view illustrating the configuration of the semiconductor device 101 according to the second preferred embodiment, showing a configuration observed from the side of the one face 11a of the printed wiring board 10 on which the first semiconductor module 20 is disposed. That is, in FIG. 12, the first semiconductor module 20, the printed wiring board 10, and the second semiconductor module (only each of the second external connection terminals 34 is illustrated) are arranged in this order from the front of the drawing.
[0067]Each of the terminal parts 12 of the printed wiring board 10 has a through hole (not illustrated...
third preferred embodiment
[0070]A semiconductor device according to a third preferred embodiment will be described. Explanation of configurations and operations similar to those in the first and second preferred embodiments will be omitted.
[0071]FIG. 13 is a cross-sectional view illustrating a configuration of a semiconductor device 102 according to the third preferred embodiment. At least one of each of the first external connection terminals 24 of the first semiconductor module 20 and each of the second external connection terminals 34 of the second semiconductor module 30 includes a press-fit terminal. In the third preferred embodiment, both of each of the first external connection terminals 24 and each of the second external connection terminals 34 are press-fit terminals. Soldering process is not necessarily required for wiring by press-fit terminals. Therefore, a design of wiring patterns in consideration of the work space and the like for the soldering iron in advance, for example, a design to widen t...
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