Particle board and method of making the same

a technology of particle board and particle board, which is applied in the field of particle board, can solve the problems of creating visually identifiable voids, unfavorable water resistance, and developing moulds and the decomposition of wooden components,

Inactive Publication Date: 2003-01-09
NICHIHA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The core layer comprises relatively large sized wooden materials hence creating visually recognizable voids.
However, while the particle board is functioning sufficiently as a bearing board member, which is unfavorable in the resistance to water because its components are mainly wooden materials.
As the particle board is poor in the function of resistance to water, its water-content gradient may cause deflections and dimensional changes of its structure or its water remaining may result in the development of mould and the decomposition of wooden constituents.
However, the prevention of water penetration through the butt ends into the particle board has not yet been achieved.
When the rate is smaller than 0.5, the mixture of the wooden materials and the resin particles in the face layers will hardly be uniform hence lowering the resistance to water of the particle board.
When the rate is smaller than 0.5, the mixture of the wooden materials and the resin particles in the core layer will hardly be uniform hence lowering the resistance to water of the particle board.
This prevents the mixture from being not uniform due to a difference in the specific gravity between the two different components.
If the temperature is lower than 150.degree. C., the thermosetting resin may fail to be hardened.

Method used

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  • Particle board and method of making the same
  • Particle board and method of making the same
  • Particle board and method of making the same

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Experimental program
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embodiment 1

[0052] Embodiment 1

[0053] A particle board according to embodiment 1 of the present invention will be described referring to FIGS. 1 to 8.

[0054] The particle board of this embodiment 1, as shown in FIG. 1, has a three-layer structure comprising a rough core layer 6 and two fine face layers 7 provided on the two, front and back, sides of the core layer 6, which is made by applying wooden materials of a needle-like (flake) shape with an adhesive, and forming.

[0055] Table 1 illustrates a distribution profile of the diameter of particles in face layer wooden materials 2 and core layer wooden materials 26. In this embodiment 1, the average particle diameter is determined from the distribution profile. As a matter of convenience, a median value of the major particle diameters in the profile shown in Table 1 is defined as the average particle diameter. More specifically, the average particle diameter of the face layer wooden materials 2 is 1.77 mm which is a median value in the profile of ...

embodiment 2

[0086] Embodiment 2

[0087] This embodiment, as shown in FIG. 9, is provided the method of making two heaped face layers constitution. To be concrete, the face layer wooden materials and the face layer resin particles are heaped two times.

[0088] The wooden materials are chopped by a crusher to have an average diameter of 2.03 mm for use as the core layer wooden materials, an average diameter of 0.89 mm for use as the first face layer wooden materials, and an average diameter of 1.77 mm for use as the second face layer wooden materials.

[0089] The profile of the average particle diameters of the core layer wooden materials and the second face layer wooden materials is substantially similar to that shown in Table 1 of Embodiment 1. The major range of the particle diameter of the first face layer wooden materials is from 0.60 mm to 1.18 mm. A median value (0.89 mm) in the major range is the average diameter.

[0090] The resin particles are crushed by a single-axis rotary shearing crusher to...

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Abstract

The object of the present invention is to provide a particle board which is improved at its entirety in the resistance to water without impairing its performance as a bearing board member and provide a method of making the particle board. A particle board of the invention having wooden materials coated with an adhesive of a thermosetting resin and pressurized with being heated, the particle board comprising: a core layer and face layers provided on both, front and back, sides of the core layer, wherein the wooden materials of the face layer are smaller in the average particle diameter than the wooden material of the core layer; and voids between the adjacent wooden materials in the face layer and the core layer are filled with resin particles of a thermoplastic resin by being pressurized with being heated.

Description

[0001] 1. Field of the Invention[0002] The present invention relates to a particle board for use as a structural material or a furniture component and a method of making the same.[0003] 2. Description of the Related Arts[0004] Particle boards are panel-like products made by bonding wooden materials with an adhesive. Most of such particle boards have a three-layer construction consisting mainly of a core layer and two face layers formed on both, front and back, sides of the core layer. The core layer comprises relatively large sized wooden materials hence creating visually recognizable voids. To the contrary, the face layers comprise relatively small sized wooden materials hence being close structure.[0005] Such particle boards are made by supplying wooden materials with a spray of an urethane adhesive, forming, and pressurizing them with heating. The urethane adhesive is hardened when its isocyanate reacts on a hydroxy functional group in the wooden materials. The amount of the adhe...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B27N3/02B27N3/06B27N3/14B32B21/02
CPCB27N3/06Y10T428/253B32B21/02B27N3/14Y10T428/31989Y10T428/249959Y10T428/31899B32B21/08B32B2479/00B32B21/042
Inventor KANEKO, SHINICHI
Owner NICHIHA CORP
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