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Very low resistance electrical interfaces to conductive loaded resin-based materials

a technology of conductive plastics and electrical interfaces, which is applied in the direction of coupling contact members, shielding material radiating elements, chemistry apparatuses and processes, etc., can solve the problems of poor connectivity, difficult and expensive formation of electrical interfaces with conductive plastics, and limited use of materials, etc., to achieve effective electrical interfaces

Inactive Publication Date: 2005-02-03
INTEGRAL TECHNOLOGY INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides an effective electrical interface to conductive loaded resin-based material. This can be achieved by forming a metal layer over the material or by altering its characteristics through the addition of conductive materials. The invention also provides methods to fabricate various forms of the conductive device using the conductive loaded resin-based material. The conductive device comprises a conductive materials in a resin-based host with a metal terminal embedded in it. The percentage of conductive materials in the material can range from 20% to 50% by weight. The metal terminal can be molded into the material or embedded into it to complete the conductive device. The technical effects of this invention include improved electrical performance and reliability of conductive devices made from resin-based materials."

Problems solved by technology

Typically, these materials are very limited in use because conductivities are too low for most circuit applications.
In addition, electrical interfaces to conductive plastics are difficult and expensive to form and result poor connectivity.

Method used

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  • Very low resistance electrical interfaces to conductive loaded resin-based materials
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  • Very low resistance electrical interfaces to conductive loaded resin-based materials

Examples

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embodiment 100

[0044] Referring now to FIG. 7, a second preferred embodiment 100 of the present invention is shown. More particularly, one embodiment 100 of a method to form the electrical interface of FIG. 1 is illustrated. Referring again to FIG. 1, an interface pin 106 of a magnetizing metal is provided. For example, the interface pin 106 comprises iron according to one embodiment. The metal pin 106 is magnetized. According to one embodiment, the pin 106 is placed into contact with a strong magnet 104 to magnetize the pin 106. The pin core 106 is then plated with a solderable metal layer 110 according to another embodiment. Alternatively, the pin 106 may be non-plated. According to yet another alternative, the metal plating is performed prior to the magnetizing step. According to yet another embodiment, the pin 106 is not plated. In another embodiment, the pin 106 is a plurality of pins, terminals, sockets, or the like.

[0045] The magnetized pin 106 and 110 is next placed into a holding fixture ...

embodiment 140

[0046] Referring now to FIG. 8, a third preferred embodiment 140 of the present invention is shown. More particularly, another embodiment 140 of a method to form the electrical interface of FIG. 1 is illustrated. Once again an interface pin with a magnetizable core 144 is provided. The interface pin core 144 comprises iron according to one embodiment. The pin core 144 is plated with a solderable metal layer 148 according to another embodiment. Alternatively, the pin 144 may be non-plated. In another embodiment, the pin 144 is a plurality of pins, terminals, sockets, or the like. The pin 144 and 148 is next placed into a holding fixture of a molding apparatus 152. While in the mold apparatus 152, the pin 144 and 148 is placed into contact with a magnet 156. In this embodiment a small, weak magnet may be used to provide a temporary magnet field through the pin 144 and 148.

[0047] Molten conductive loaded resin-based material 160 is then injected into the mold 152 such that the pin 144 ...

embodiment 200

[0049] Referring now to FIG. 9, a fourth preferred embodiment 200 of the present invention is illustrated. In this embodiment, a conductive terminal 204 is embedded into the conductive loaded resin-based material device 208 after the device 208 has been molded. According to the illustrated embodiment, the conductive terminal 204 comprises a metal screw 204 that is driven into the conductive loaded resin-based material device 208 such that the shaft of the screw 204 intersects the conductive matrix. Alternatively, the conductive terminal 204 comprises a pin, nail, staple, or the like, that is mechanically driven into the conductive loaded resin-based device 208. After the conductive terminal 204 is embedded, a connector tab 212 is solder 216 bonded to the terminal 204 according to the illustration. In this case, the conductive terminal 204 comprises, or is plated with, a solderable metal such as copper or brass.

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Abstract

Electrical interfaces formed into a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Description

[0001] This Patent Application claims priority to the U.S. Provisional Patent Application 60 / 499,452 filed on Sep. 2, 2003, which is herein incorporated by reference in its entirety. [0002] This Patent Application is a Continuation-in-Part of INT01-002CIP, filed as U.S. patent application Ser. No. 10 / 309,429, filed on Dec. 4, 2002, also incorporated by reference in its entirety, which is a Continuation-in-Part application of docket number INT01-002, filed as U.S. patent application Ser. No. 10 / 075,778, filed on Feb. 14, 2002, which claimed priority to U.S. Provisional Patent Applications Ser. No. 60 / 317,808, filed on Sep. 7, 2001, Ser. No. 60 / 269,414, filed on Feb. 16, 2001, and Ser. No. 60 / 268,822, filed on Feb. 15, 2001.BACKGROUND OF THE INVENTION [0003] (1) Field of the Invention [0004] This invention relates to conductive resin-based materials and, more particularly, to electrical interfaces to conductive loaded resin-based materials molded of conductive loaded resin-based mater...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C09K5/14H01BH01Q1/40H01R13/03H01R43/24
CPCC09K5/14H01R13/03H01R43/24Y10T29/49171Y10T29/4902Y10T29/49151Y10T29/49117Y10T29/49153Y10T29/49149Y10T29/49147Y10T29/49174
Inventor AISENBREY, THOMAS
Owner INTEGRAL TECHNOLOGY INC
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