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Constructing of an electronic assembly having a decoupling capacitor

a technology of decoupling capacitor and electronic assembly, which is applied in the direction of electrical apparatus construction details, sustainable manufacturing/processing, and final product manufacturing, etc., can solve the problem of high cost of process

Inactive Publication Date: 2005-04-28
DISHONGH TERRANCE J +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The invention relates to an electronic assembly with a decoupling capacitor and a method for manufacturing it. The decoupling capacitor is placed between the semiconductor package and the motherboard, and it helps reduce inductive-capacitance delay. The method includes steps of placing the capacitor on the motherboard, soldering it to the BGA solder balls, and reflowing the solder ball interconnection members. The technical effect of the invention is to provide a more efficient and cost-effective way to connect the decoupling capacitor to the motherboard."

Problems solved by technology

Such a process is expensive because it requires additional manufacturing steps, including the placement of the capacitor, and controlled heating and cooling of the solder ball interconnection members so that they reflow over capacitor terminals of the capacitor.

Method used

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  • Constructing of an electronic assembly having a decoupling capacitor
  • Constructing of an electronic assembly having a decoupling capacitor
  • Constructing of an electronic assembly having a decoupling capacitor

Examples

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Embodiment Construction

[0014] An electronic assembly is provided, having a capacitor interconnected between BGA solder balls. The capacitor is placed on a motherboard and soldered to the BGA solder balls when the BGA solder balls are soldered to electric lands on the motherboard.

[0015]FIG. 1 of the accompanying drawings illustrates an electronic assembly 8 according to an embodiment of the invention. The electronic assembly 8 includes a motherboard 10, a semiconductor package 12, and a capacitor 14 mounted to the motherboard 10.

[0016] The motherboard 10 includes a carrier substrate 16 which is made of a nonconductive dielectric material. The motherboard 10 further has a plurality of electric lands 18 that are formed near an upper surface of the carrier substrate 16. The motherboard 10 further has power and ground planes 20 and 22 respectively. The electric lands 18 and the power and ground planes 20 and 22 are at the same elevation and are formed below an upper surface of a solder mask or upper dielectr...

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Abstract

An electronic assembly is provided, having a capacitor interconnected between BGA solder balls. The capacitor is placed on a motherboard and soldered to the BGA solder balls when the BGA solder balls are soldered to electric lands on the motherboard.

Description

BACKGROUND OF THE INVENTION [0001] 1). Field of the Invention [0002] This invention relates to an electronic assembly having a decoupling capacitor and to a method according to which it is constructed. [0003] 2). Discussion of Related Art [0004] Integrated circuits are usually manufactured in and on semiconductor wafers that are subsequently diced or singulated into individual microelectronic dies. Such a microelectronic die is usually mounted to a package substrate for purposes of providing rigidity thereto and through which signals can be provided to and from the integrated circuit. Such a package substrate often has an array of solder ball interconnection members, also referred to as a ball grid array (BGA), on an opposing surface that are placed on electric lands of a motherboard and, by a thermal reflow process, soldered thereto. [0005] Such a motherboard usually includes a carrier substrate with a power plane and a ground plane therein. A power source is connected to the power...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L23/498H01L23/50H05K1/02H05K1/14H05K3/34H05K7/10
CPCH01L23/49816H05K2201/10734H01L2224/16H01L2924/15174H01L2924/15311H01L2924/19106H05K1/0231H05K1/145H05K3/3436H05K3/3442H05K7/1092H05K2201/10515H05K2201/1053H05K2201/10636H01L23/50Y02P70/50
Inventor DISHONGH, TERRANCE J.PEARSON, TOM E.
Owner DISHONGH TERRANCE J