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Device packages with low stress assembly process

a technology of assembly process and device, applied in the field of packaging stress sensitive devices, can solve the problems of stress sensitive devices such as optical devices, microelectromechanical systems, photo detectors, etc., and achieve the effect of reducing thermal stress and warpage to tolerable levels

Inactive Publication Date: 2005-05-05
VENTURE LENDING & LEASING IV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0005] In view of the foregoing, the present invention discloses a method of packaging stress sensitive devices. Stresses, such as ther

Problems solved by technology

Stress sensitive devices, such as optical devices (e.g. photo detectors, CCDs, LCD, photodiodes), microelectromechanical systems (e.g. spatial light modulators using micromirrors) may suffer from device failure due to warping and stresses induced either during device packaging processes or in operation after improper packaging processes.
When the coefficient of thermal expansion (CTE) of the package substrate does not match the device substrate that contacts the package substrate, the device will be warped, resulting in device failure.
However, this is not achievable in many situations because the selection of the device substrate and also the package substrate need to satisfy other requirements with higher priority.

Method used

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  • Device packages with low stress assembly process
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Embodiment Construction

[0022] Turning to the drawings, the present invention is illustrated as being implemented in a suitable packaging process for stress sensitive devices, such as optical devices (e.g. photo detectors, CCDs, LCD, photodiodes) and microelectromechanical systems (e.g. spatial light modulators using micromirrors). The following description is based on selected embodiments of the invention and should not be interpreted as a limitation of the invention with regard to alternative embodiments that are not explicitly described herein.

[0023] Referring to FIG. 1a, a packaging substrate for packaging stress sensitive devices is illustrated therein. Packaging substrate 200 comprises substrate layer 210 and substrate layer 215. Substrate layer 210 has a concave surface that forms a cavity in which the stress sensitive device can be disposed. As an alternative feature, heater 220 is formed along the periphery of the concave surface of substrate layer 210. Electric current from external electric pow...

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PUM

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Abstract

A microelectromechanical device package and a low-stress inducing method for packaging a microelectromechanical device are disclosed in this invention. The microelectromechanical device is accommodated within a cavity comprised by a first package substrate and a second substrate, wherein a third substrate is disposed between and bonded to both the microelectromechanical device lower semiconductor substrate and the package bottom substrate. The first and second package substrates are then bonded so as to package the microelectromechanical device inside.

Description

TECHNICAL FIELD OF THE INVENTION [0001] The present invention is generally related to the art of packaging devices, and more particularly, to packaging stress sensitive devices. BACKGROUND OF THE INVENTION [0002] Stress sensitive devices, such as optical devices (e.g. photo detectors, CCDs, LCD, photodiodes), microelectromechanical systems (e.g. spatial light modulators using micromirrors) may suffer from device failure due to warping and stresses induced either during device packaging processes or in operation after improper packaging processes. In a typical packaging process, the device is attached to a package substrate for holding the device. When the coefficient of thermal expansion (CTE) of the package substrate does not match the device substrate that contacts the package substrate, the device will be warped, resulting in device failure. [0003] An approach to solve this problem is to select device substrate and package substrate having the same or similar CTEs. However, this ...

Claims

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Application Information

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IPC IPC(8): B81B7/00H01L21/44H01L23/34
CPCB81C2203/019B81B7/0048H01L2224/16225
Inventor TARN, TERRY
Owner VENTURE LENDING & LEASING IV