Method and apparatus for providing an integrated circuit cover

Abstract

An integrated circuit cover incorporating a spring portion is described. The spring portion may include any structure that allows displacement between a plate portion of the integrated circuit cover and an attachment portion of the integrated circuit cover and that provides a substantially equalizing effect of pressure on the plate portion. The spring portion is preferably more flexible than the plate portion. The integrated circuit cover accommodates variations in the mounted height of integrated circuits over which the integrated circuit cover is installed. The integrated circuit cover may be formed as a unitary structure or may be constructed as an assembly of multiple components.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This patent application is a continuation of U.S. patent application Ser. No. 09 / 944,545, filed Aug. 31, 2003, which is hereby incorporated by reference herein in its entirety.FIELD OF THE DISCLOSURE [0002] The present disclosure relates generally to integrated circuit packaging and, more specifically, to an integrated circuit cover. BACKGROUND OF THE DISCLOSURE [0003] As electronic systems have increased in complexity, attempts have been made to increase the amount of electronic circuitry contained in a given amount of space. One existing approach is to mount integrated circuits on a circuit board and cover them with an cover. The cover provides physical protection for the integrated circuits and serves as a heat spreader to help dissipate heat from the integrated circuits. An existing integrated circuit cover does not accommodate height variations of mounted integrated circuits. Consequently, a variety of integrated circuit covers, ea...

AI Technical Summary

Benefits of technology

This solution reduces mechanical stress, enhances even thermal conductivity, simplifies production and inventory, and reduces costs while providing improved thermal performance and protection for integrated circuits.

Problems solved by technology

As electronic systems have increased in complexity, attempts have been made to increase the amount of electronic circuitry contained in a given amount of space.

An existing integrated circuit cover does not accommodate height variations of mounted integrated circuits.

This variety of integrated circuit covers results in complicated production and inventory issues.

However, the geometry of the assembly results in pressure being localized near fasteners 104 and 105.

Thus, even when an integrated circuit cover of a particular height is selected, dimensional distortion of the integrated circuit cover can result in uneven thermal conductivity and reduced performance.

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