Aluminum bonding member and method for producing same

Abstract

There is provided an aluminum bonding member capable of being simply and inexpensively produced and capable of being used as a cooling member having a high cooling power. The aluminum bonding member 10 has an aluminum member 12 of aluminum or an aluminum alloy exposed to the outside, and a tubular member 14 of a material which does not melt at a temperature close to the melting point of aluminum or the aluminum alloy. Both of the opening end portions of the tubular member 14 are open to the outside of the aluminum member 12. A portion of the tubular member 14 between the opening end portions extends in the aluminum member 12, and the outer peripheral surface of the portion of the tubular member 14 extending in the aluminum member 12 is bonded directly to the aluminum member 12.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention generally relates to an aluminum bonding member and a method for producing the same. More specifically, the invention relates to an aluminum bonding member, in which a tubular member for allowing the flow of a cooling agent and which is used as a cooling member for electronic parts, such as metal / ceramic circuit boards, and a method for producing the same. [0003] 2. Description of the Prior Art [0004] As a conventional method for mounting a cooling member, such as a radiating fin, on a metal / ceramic circuit board wherein a metal circuit plate is bonded to one side of a ceramic substrate and a radiating metal plate is bonded to the other side thereof, there is known a method for soldering one or a plurality of ceramic substrates, to each of which a metal circuit plate having a semiconductor chip soldered thereon is bonded, on a metal base plate (a radiating plate) or a composite material and for...

AI Technical Summary

Benefits of technology

[0017] According to the present invention, it is possible to simply and inexpensively produce an aluminum bonding member capable of being used as a cooling member having a high cooling power.

Problems solved by technology

However, in the conventional method for soldering a ceramic substrate on a metal base plate, heat sink characteristics are deteriorated by the solder, and the thermal conductivity of the radiating grease used for mounting the radiating fin on the metal base plate or the like is a few W / mK which is extremely small, so that there is a problem in that the heat sink characteristics are further deteriorated.

In addition, there are some cases where the yield of products may be deteriorated by solder voids.

In the method disclosed in Japanese Patent Laid-Open No. 4-363052, since an air cooling radiating fin is used, the cooling power of the radiating fin is generally lower than that of a water cooling system, so that there is a problem in that it is difficult to stabilize the performance of the radiating fin.

Therefore, costs for the die and producing apparatus are relatively high, and there are some cases where it is difficult to enhance the uniformity and working precision of the preform substrates.

Moreover, since the porosity of the preform substrates is not less than 5% and is less than 50%, there are some cases where it is difficult to fill a molten metal in the preform substrates to mechanically realize the bonding by the anchor effect.

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