Aluminum bonding member and method for producing same

a technology of aluminum bonding and aluminum foil, which is applied in the direction of laminated elements, basic electric elements, light and heating apparatus, etc., can solve the problems of difficult to stabilize the performance of radiating fins, deterioration of heat sink characteristics, and difficulty in ensuring the stability of radiating fins, etc., to achieve simple and inexpensive production of aluminum bonding members and high cooling power
US20050217823A1Inactive Publication Date: 2005-10-06DOWA METALTECH CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
DOWA METALTECH CO LTD
Publication Date
2005-10-06
Estimated Expiration
Not applicable · inactive patent

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Abstract

There is provided an aluminum bonding member capable of being simply and inexpensively produced and capable of being used as a cooling member having a high cooling power. The aluminum bonding member 10 has an aluminum member 12 of aluminum or an aluminum alloy exposed to the outside, and a tubular member 14 of a material which does not melt at a temperature close to the melting point of aluminum or the aluminum alloy. Both of the opening end portions of the tubular member 14 are open to the outside of the aluminum member 12. A portion of the tubular member 14 between the opening end portions extends in the aluminum member 12, and the outer peripheral surface of the portion of the tubular member 14 extending in the aluminum member 12 is bonded directly to the aluminum member 12.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention generally relates to an aluminum bonding member and a method for producing the same. More specifically, the invention relates to an aluminum bonding member, in which a tubular member for allowing the flow of a cooling agent and which is used as a cooling member for electronic parts, such as metal / ceramic circuit boards, and a method for producing the same.

[0003] 2. Description of the Prior Art

[0004] As a conventional method for mounting a cooling member, such as a radiating fin, on a metal / ceramic circuit board wherein a metal circuit plate is bonded to one side of a ceramic substrate and a radiating metal plate is bonded to the other side thereof, there is known a method for soldering one or a plurality of ceramic substrates, to each of which a metal circuit plate having a semiconductor chip soldered thereon is bonded, on a metal base plate (a radiating plate) or a composite material and for...

Claims

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