Cooling-assisted, heat-generating electrical component and method of manufacturing same

Abstract

A cooling-assisted, heat-generating electrical component reduces heat generated during operation. The electrical component, typically a resistor, has a least one heat-removing element electrically associated therewith. Heat-removing element comprises a plurality of thermal vias therein and is fixedly attached to an end portion of the electrical component, typically on opposed end portions. Heat absorbed by the heat-removing element can be transported away from the electrical component during service.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] The present application is related to U.S. application Ser. No. ______(Docket 84843), filed ______, by Tina P. Barcley, and entitled, “Insitu-Cooled Electrical Assemblage And Method Of Manufacturing Same;” and U.S. application Ser. No. ______(Docket 84844), filed ______, by Tina P. Barcley, and entitled, “Method of Cooling Heat-Generating Electrical Components.”FIELD OF THE INVENTION [0002] The invention relates to improvements in heat transfer in electronic technology. More particularly, the invention concerns electrical assemblages, such as circuit boards, which reduce heat generated in ceramic “chip” components during service. BACKGROUND OF THE INVENTION [0003] It is well known that overheating of electrical components, for instance components mounted on a circuit board, contributes to reducing the life of the component. Overall component reliability is also compromised by excessive overheating during service. As circuit boards becom...

AI Technical Summary

Benefits of technology

[0007] It is, therefore, an object of the present invention to provide an electrical component protected from deterioration due to overheating during service.

[0008] Another object of the invention is to provide such an electrical component that is considerably more reliable, has a longer useful life and is cost effective to build and use.

[0011] The present invention has numerous advantages over existing developments including reliability, cost effectiveness, ease of development, and increased component useful life. Moreover, the present invention has the advantage of being applicable to practically any ceramic chip, ball grid array (BGA), direct die attached components, chip-on-board, and smaller chip resistors, such as the 2010, 1206, etc.

Problems solved by technology

It is well known that overheating of electrical components, for instance components mounted on a circuit board, contributes to reducing the life of the component.

Overall component reliability is also compromised by excessive overheating during service.

As circuit boards become denser and contain components that have higher power output capacity, reliability problems become magnified for solder joints of the circuit board, particularly in “chip” ceramic type parts due to CTE (Coefficient of Thermal Expansion) differences.

The current trend in the industry is to either assume the reliability risk or to institute extremely expensive chip construction processes for removing excess heat.

Both practices have proven undesirable from a cost management standpoint.

In a typical electronic package, the largest chip ceramic component, for instance the 2512 resistor, is the least reliable component on most circuit boards and the component most likely to fracture its solder joint due to thermal cycling.

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