Coat/develop module with shared dispense

a technology of a dispense module and a dispense device, which is applied in the direction of programme control, printers, and total factory control, etc., can solve the problems of large processing time, large processing time, and inability to provide a number of different coatings, so as to reduce the number of redundant systems, reduce the cost of the dispense system, and reduce the complexity and footprint of the system.

Active Publication Date: 2006-06-22
SCREEN SEMICON SOLUTIONS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0019] Many benefits are achieved by way of the present invention over conventional techniques. For example, the present technique allows for sharing of some common components, reducing system cost, complexity, and footprint. Moreover, embodiments of the pre...

Problems solved by technology

As a result of the number and quality of the dispense nozzles in some of these modules, the cost of the dispense system may be much larger than the cost of the spin bowl.
Therefore, in some dispense systems, the most expensive system components, namely those included in the dispense apparatus, are idle during a significant fraction of the processing time.
The system as illustrated in U.S. Pat. No. 5,205,114 suffers from several problems.
First, the system provides only a single resi...

Method used

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  • Coat/develop module with shared dispense
  • Coat/develop module with shared dispense
  • Coat/develop module with shared dispense

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Embodiment Construction

[0032] According to the present invention, techniques related to the field of semiconductor processing equipment are provided. More particularly, the present invention includes a method and apparatus for dispensing fluids onto a semiconductor substrate. Merely by way of example, the method and apparatus has been applied to two processing chambers in a coat / develop module sharing a central fluid dispense bank. But it would be recognized that the invention has a much broader range of applicability.

[0033]FIG. 7 is a plan view of one embodiment of a track lithography tool 710 that illustrates a number of the aspects of the present invention that may be used to advantage. One embodiment of the track lithography 710, as illustrated in FIG. 7, contains a front end module (sometimes referred to as a factory interface) 750, a central module 850, and a rear module (sometimes referred to as a scanner interface) 900. The front end module 750 generally contains one or more pod assemblies or FOU...

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Abstract

An apparatus for dispensing fluid during semiconductor substrate processing operations. The apparatus includes a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources and a first processing chamber positioned to a first side of the central fluid dispense bank. The apparatus also includes a second processing chamber positioned to a second side of the central fluid dispense bank and a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber, and the second processing chamber.

Description

CROSS-REFERENCES TO RELATED APPLICATIONS [0001] This application claims the benefit of U.S. Provisional Application Ser. No. 60 / 639,109, filed Dec. 22, 2004, entitled “Twin Architecture For Processing A Substrate,” which is incorporated herein by reference. [0002] The following two regular U.S. patent applications (including this one) are being filed concurrently, and the entire disclosure of the other application is incorporated by reference into this application for all purposes. [0003] application Ser. No. ______, filed ______, entitled “Coat / Develop Module with Shared Dispense” (Attorney Docket No. A9873 / T60100); [0004] application Ser. No. ______, filed ______, entitled “Coat / Develop Module with Independent Stations” (Attorney Docket No. A9873.2 / T60110);BACKGROUND OF THE INVENTION [0005] The present invention relates generally to the field of semiconductor processing equipment. More particularly, the present invention relates to a method and apparatus for dispensing fluids onto...

Claims

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Application Information

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IPC IPC(8): B05C13/02B05C13/00B05C11/02
CPCH01L21/67173H01L21/67745H01L22/26H01L21/67196H01L21/6831G03B27/32Y10S414/136H01L21/67109H01L21/68707H01L21/67742H01L21/6719G03F7/40Y10T29/53187H01L21/67161Y10S414/135H01L21/67754H01L21/67178G03D13/006H01L21/67748G05B2219/40476Y10T29/5323G05B19/41825H01L21/67184G05B2219/49137H01L21/6838H01L21/6715G05B2219/45031H01L21/67225Y02P90/02
Inventor ISHIKAWA, TETSUYAROBERTS, RICK
Owner SCREEN SEMICON SOLUTIONS CO LTD
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