System and method to customize bond programs compensating integrated circuit bonder variability

a technology of integrated circuit bonding and program customization, applied in the field of electronic systems and semiconductor devices, can solve the problems of reducing the accuracy of pattern recognition system reference placement, wire bonding techniques, and the inability of the bond head to place the bonds, so as to reduce the error rate of operation program
US20060217817A1Inactive Publication Date: 2006-09-28BON DAVID J +1
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
BON DAVID J
Publication Date
2006-09-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

A computerized system and method for customizing bond programs in order to compensate first for variabilities in an integrated circuit (IC) “slave” bonder, and second to any irregularities in a “slave” circuit positioned on the slave bonder for attaching connecting bonds onto the IC bond pads. According to the invention, a “master” segmentator groups the bond pads of a “master” circuit on a master bonder into segments and stores the reference data related to these segments in a master file. Next, a slave regenerator, coupled to the master file, regenerates the master reference data so that variable characteristics of the slave bonder are defined and adaptively compensated. Finally, a slave corrector, coupled to the salve regenerator, corrects the bond program for the slave circuit on the adaptively compensated slave bonder. The slave bonder attaches the connecting bonds based on the computed correct bond locations.
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Description

[0001] This is a divisional application of co-pending application Ser. No. 09 / 855,893 filed on May 15, 2001, which claims priority from provisional application Ser. No. 60 / 204,997 filed May 16, 2000. The contents of the parent application are herein incorporated by reference in its entirety.FIELD OF THE INVENTION

[0002] The present invention is related in general to the field of semiconductor devices and electronic systems and more specifically to bond program customization and operation of computer-controlled bonding machines used in integrated circuit assembly. DESCRIPTION OF THE RELATED ART

[0003] In integrated circuit (IC) assembly, an IC chip is typically mounted on a leadframe and electrically connected to it by metallic segments. Commonly, the chip assembly is encapsulated in a protective package (for instance, ceramic package, or plastic package using molding process). Typically, the IC chip has a plurality of bond pads, which are often positioned around the chip perimeter; ...

Claims

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