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Processes for the production of organometallic compounds

a technology of amidinate and compounds, which is applied in the direction of organic chemistry, ruthenium organic compounds, iron organic compounds, etc., can solve the problems of reduced surface area to volume ratio of interconnection, increased difficulty in detecting and detecting tantalum metals, and inability to deposit tantalum metals using atomic layer deposition. , to achieve the effect of improving morphology, improving thermal stability, and less diffusion

Inactive Publication Date: 2006-10-12
PRAXAIR TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0021] This invention relates in particular to depositions involving amidinate-based ruthenium precursors. These precursors may have advantages over the other known precursors, especially when utilized in tandem with other ‘next-generation’ materials (e.g., hafnium, tantalum and molybdenum). These ruthenium-containing materials can be used for a variety of purposes such as dielectrics, barriers, and electrodes, and in many cases show improved properties (thermal stability, desired morphology, less diffusion, lower leakage, less charge trapping, and the like) than the non-ruthenium containing films. These amidinate-based ruthenium precursors may be deposited by atomic layer deposition employing a hydrogen reduction pathway in a self-limiting manner, thereby enabling use of ruthenium as a barrier / adhesion layer in conjunction with tantalum nitride in BEOL liner applications. Such amidinate-based ruthenium precursors deposited in a self-limiting manner by atomic layer deposition may enable conformal film growth over high aspect ratio trench architectures in a reducing environment.
[0022] The invention has several advantages. For example, the processes of the invention are useful in generating organometallic compound precursors that have varied chemical structures and physical properties. Films generated from the organometallic compound precursors can be deposited in a self-limiting manner with a short incubation time, and the films deposited from the organometallic compound precursors exhibit good smoothness.

Problems solved by technology

This will result in a decrease of the surface area to volume ratio of the interconnect, concomitant with an increase in the volume occupied by the diffusion barrier.
As the barrier occupies more of the interconnect channel space, the effective resistivity of the interconnect increases for two reasons: first, decrease in the size of the interconnect and second, copper / barrier surface scattering of electrons becomes a more critical issue.
Unfortunately, no chemistries exist that can deposit tantalum metal using atomic layer deposition.
Without tantalum, copper delaminates from the tantalum nitride film compromising device performance.
Oxygen based chemistries are incompatible with a BEOL integration sequence since the presence of trace amounts of oxygen within the deposited film could diffuse into the copper channel resulting in the formation of copper oxides compromising device performance.
In addition to being hydrogen reducible, chemistries should deposit in a self-limiting manner.
The problem is that there are no known suitable hydrogen reducible ruthenium complexes of sufficient volatility for use as atomic layer deposition precursors, and as such, no self-limiting, hydrogen reducible precursors have been identified.
The economics associated with such processes together with the rigid requirements of the electronics industry make the synthesis of organometallic precursors challenging.

Method used

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  • Processes for the production of organometallic compounds
  • Processes for the production of organometallic compounds
  • Processes for the production of organometallic compounds

Examples

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example 1

[0088] Synthesis of lithium (N,N′-diisopropylacetamidinate)

[0089] A dry 500 milliliter 3-neck round-bottom flask was equipped with a 100 milliliter dropping funnel, a Teflon stir bar, and a thermocouple. The system was connected to an inert atmosphere (N2) nitrogen manifold and the remaining outlets were sealed with rubber septa. To this flask was added 155 milliliters of tetrahydrofuran (THF) and 13.99 grams of diisopropylcarbodiimide. The solution was cooled to −50° C. by use of a dry ice / acetone bath. 72 milliliters of 1.6 M MeLi in diethyl ether was added to the dropping funnel. The MeLi solution was added dropwise to the diisopropylcarbodiimide solution at a rate sufficiently slow to keep the temperature of the solution below −30° C. Following the addition the solution was allowed to warm to room temperature overnight. The pale yellow solution can be used either as a solution of lithium (N,N′-diisopropylacetamidinate) or the solvent can be removed to isolate the salt.

[0090] S...

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Abstract

This invention relates to processes for the production of organometallic compounds represented by the formula M(L)3 wherein M is a Group VIII metal, e.g., ruthenium, and L is the same or different and represents a substituted or unsubstituted amidinato group or a substituted or unsubstituted amidinato-like group, which process comprises (i) reacting a substituted or unsubstituted metal source compound, e.g., ruthenium (II) compound, with a substituted or unsubstituted amidinate or amidinate-like compound in the presence of a solvent and under reaction conditions sufficient to produce a reaction mixture comprising said organometallic compound, e.g., ruthenium (III) compound, and (ii) separating said organometallic compound from said reaction mixture. The organometallic compounds are useful in semiconductor applications as chemical vapor or atomic layer deposition precursors for film depositions.

Description

FIELD OF THE INVENTION [0001] This invention relates to processes for producing organometallic amidinate compounds, a method for producing a film or coating from the organometallic amidinate compounds, and ruthenium amidinate compounds that are hydrogen reducible and deposit in a self-limiting manner. The organometallic amidinate compounds are useful in semiconductor applications as chemical vapor or atomic layer deposition precursors for film depositions. BACKGROUND OF THE INVENTION [0002] In existing semiconductor devices, transistors communicate with one another via an elaborate series of copper interconnects connected through a series of metal layers above the transistor. To minimize the capacitive coupling between these interconnects, the space between is occupied by a material with a low dielectric constant (i.e., low-K materials). To prevent the diffusion of copper into this low-K material, a composite barrier is put in place. Current practices use physical vapor deposition t...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C07F15/00C07F15/02
CPCC23C16/18C07F15/0046C07F15/02C07F15/00
Inventor THOMPSON, DAVID MICHAEL
Owner PRAXAIR TECH INC
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