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Latent hardener

Inactive Publication Date: 2007-01-11
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0012] The latent curing agent of the present invention, which consists of an aluminum chelating agent and a porous resin carrier for the aluminum chelating agent, the carrier being obtained through interfacial polymerization of a polyfunctional isocyanate compound, can cure thermosetting epoxy resins at a relatively low temperature and in a relatively short period of time. In addition, curing conditions for the latent curing agent can be controlled in a relatively easy fashion by the method of the present invention for producing the latent curing agent, since the method involves dissolving an aluminum chelating agent and a polyfunctional isocyanate compound in a volatile organic solvent, adding the resulting solution to an aqueous phase containing a dispersing agent, and stirring the mixture while the mixture is heated to cause interfacial polymerization of the isocyanate compound.

Problems solved by technology

As a result, the microcapsules obtained tend to have non-uniform and rough surfaces, and the resulting curing agents cannot achieve stable curing characteristics, making it difficult to control the conditions for curing.

Method used

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Examples

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Effect test

example 1

[0074] 800 parts by weight of distilled water, 0.05 parts by weight of a surfactant (Newrex, available from NOF Co., Ltd.), and 4 parts by weight of polyvinyl alcohol (PVA-205, available from KURARAY Co., Ltd.) to serve as a dispersing agent were placed in a three-liter thermometer-equipped vessel intended for interfacial polymerization, and the mixture was thoroughly mixed. Meanwhile, 11 parts by weight of a 24% isopropanol solution of aluminum monoacetylacetonate bis(ethylacetoacetate) (Alumichelate D, available from KAWAKEN FINE CHEMICALS Co., Ltd.) and 11 parts by weight of a methylenediphenyl-4,4′-diisocyanate (3 mol) / trimethylolpropane (1 mol) adduct (D-109, available from MITSUI TAKEDA CHEMICALS Inc.) were dissolved in 30 parts by weight of ethyl acetate to form an organic phase solution. This solution was added to the above-prepared mixture and the resulting mixture was emulsified by a homogenizer (at 11000 rpm for 10 min). Then, the interfacial polymerization was allowed to...

example 2

[0076] The same procedure was followed as in Example 1, except that toluene diisocyanate (3 mol) / methylenediphenyl-4,4′-diisocyanate (3 mol) / trimethylolpropane (1 mol) adduct (D-103M-2, MITSUI TAKEDA CHEMICALS Inc.) was used in place of methylenediphenyl-4,4′-diisocyanate (3 mol) / trimethylolpropane (1 mol) adduct, to obtain 20 parts by weight of a spherical latent curing agent sized approximately 10 μm.

example 3

[0077] The same procedure was followed as in Example 1, except that toluene diisocyanate (3 mol) / trimethylolpropane (1 mol) adduct (D-103, available from MITSUI TAKEDA CHEMICALS Inc.) was used in place of methylenediphenyl-4,4′-diisocyanate (3 mol) / trimethylolpropane (1 mol) adduct, to obtain 20 parts by weight of a spherical latent curing agent sized approximately 10 μm.

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Abstract

A latent curing agent that can cure a thermosetting epoxy resin in a relatively short period of time and at a relatively low temperature has a structure in which an aluminum chelating agent is held by a porous resin carrier obtained through interfacial polymerization of a polyfunctional isocyanate compound. The aluminum chelating agent is preferably a complex compound comprising β-ketoenolate anion ligands coordinated to aluminum. The latent curing agent can be produced by dissolving the aluminum chelating agent and the polyfunctional isocyanate compound in a volatile organic solvent, adding the resulting solution to an aqueous phase containing a dispersing agent, and stirring the resulting mixture to cause interfacial polymerization of the isocyanate compound while the mixture is being heated.

Description

TECHNICAL FIELD [0001] The present invention relates to a latent curing agent that can initiate curing of thermosetting epoxy resin compositions at relatively low temperature. The present invention also relates to a method for producing such a latent curing agent, as well as to a thermosetting epoxy resin composition that contains the latent curing agent and is thus highly stable during storage. BACKGROUND ART [0002] Thermosetting epoxy resin compositions are widely used as adhesives and molding materials. Among different curing agents used to cure thermosetting epoxy resin compositions are imidazole latent curing agents. These imidazole latent curing agents do not cure under normal storage conditions and are thus widely used to make thermosetting epoxy resin compositions into one-pack type curable compositions that are easy to handle and are stable during storage. One example of such imidazole latent curing agents includes an agent provided in the form of microcapsules in which par...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/10C08G18/08C08G18/58C08G18/79C08G59/18C08G59/70H05K3/32
CPCC08G18/79C08G59/70H05K3/323C08G18/0852C08G18/58C08G59/188C08G59/00C08G59/18
Inventor KAMIYA, KAZUNOBUYOSHINARI, MAKOTO
Owner DEXERIALS CORP
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