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Polishing pad having edge surface treatment

Inactive Publication Date: 2007-01-18
PPG IND OHIO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008] The present invention is directed to a polishing pad having a sublayer and a polishing layer. The surface of the outer peripheral edge of the sublayer can be at least partially treated to reduce the absorption or permeation of polishing fluid into the sublayer through the outer peripheral edge. The application of the surface treatment at least reduces the amount of polishing fluid absorbed by the sublayer of the polishing pad during the polishing process. The polishing pad of the present invention is useful in polishing microelectronic substrates and especially useful in chemical mechanical planarization of semiconductor wafers.

Problems solved by technology

Any numerical value, however, inherently contain certain errors necessarily resulting from the standard deviation found in their respective testing measurements.

Method used

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  • Polishing pad having edge surface treatment
  • Polishing pad having edge surface treatment

Examples

Experimental program
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Effect test

example 1

[0063] Using a small sponge, micronized polypropylene in powder form was wiped onto the sublayer 14 outer peripheral edge 16 of a stacked polishing pad 10 commercially obtained from Rodel, Inc., Newark, Del., under the trade name IC1400. The micronized polypropylene was commercially obtained from Lubrizol Corporation, Wickliffe, Ohio under the trade name Lanco PP1362D. Following application of the micronized polypropylene, the stacked pad 10 was immersed in slurry for one hour. The slurry was commercially obtained from Rodel, Inc., Newark, Del. under the trade name ILD 1300 Planarization Slurry. The pad 10 was removed from the slurry and the outer peripheral edge 16 was visually inspected. The outer peripheral edge 16 of the sublayer 14 appeared dry.

example 2

[0064] The process as described in Example 1 was carried out with the exception that the micronized polypropylene was replaced with hydrophobic fumed silica obtained from Degussa Corporation, Parsippany, N.J., under the trade name Aerosil R805. The outer peripheral edge 16 of the sublayer 14 appeared dry.

example 3

[0065] Hydrophobic fumed silica commercially obtained from Degussa Corporation, Parsippany, N.J., under the trade name Aerosil R202, was dispersed in acetone at a concentration of one (1) weight percent. Using a Texwipe clean room swab, No. TX761, commercially obtained from Fisher Scientific, Pittsburgh, Pa., the solution was applied to the sublayer 14 outer peripheral edge 16 of a 22.5-inch stacked polishing pad 10 commercially obtained from Thomas West, Incorporated, under the trade name WESTPADS, Model No. STT 711-C561-22.5. The sublayer 14 outer peripheral edge 16 was treated using 0.8 grams of the 1% solution. Following application of treatment solution, the pad 10 stack was held at ambient conditions for 2 hours then immersed in ILD 1300 slurry for one hour. The pad 10 was then removed from the slurry and the sublayer 14 outer peripheral edge 16 was visually inspected. The outer peripheral edge 16 of the sublayer 14 appeared dry.

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Abstract

A polishing pad has a sublayer and a polishing layer, wherein the surface of the outer peripheral edge of the sublayer can be at least partially treated to reduce the absorption or permeation of polishing fluid into the sublayer through the outer peripheral edge. The application of the surface treatment at least reduces the amount of polishing fluid absorbed by the sublayer of the polishing pad during the polishing process. The polishing pad of the present invention is useful in polishing microelectronic substrates and especially useful in chemical mechanical planarization of semiconductor wafers.

Description

RELATED APPLICATIONS [0001] This application is continuation-in-part of U.S. patent application Ser. No. 10 / 898,258 filed on Jul. 26, 2004 which is a conversion of U.S. Provisional Patent Application having Ser. No. 60 / 493,292, filed on Aug. 7, 2003.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention is directed to a polishing pad having a sublayer and a polishing layer that is constructed to reduce the absorption or permeation of polishing fluid into the sublayer through the outer peripheral edge. [0004] 2. Background Information [0005] It is typical to use polishing fluid, such as polishing slurry, in conjunction with a polishing pad to polish a microelectronic substrate. The polishing pad can comprise a stacked pad construction including a sublayer. During the polishing process, it is advantageous to at least reduce or minimize the adsorption of slurry into the sublayer. Absorption of slurry into the sublayer can alter or change the compressi...

Claims

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Application Information

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IPC IPC(8): B24D11/00B24B37/04B24D13/14
CPCB24B37/22
Inventor SWISHER, ROBERT G.WANG, ALAN E.
Owner PPG IND OHIO INC
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