Polishing pad having edge surface treatment

Abstract

A polishing pad has a sublayer and a polishing layer, wherein the surface of the outer peripheral edge of the sublayer can be at least partially treated to reduce the absorption or permeation of polishing fluid into the sublayer through the outer peripheral edge. The application of the surface treatment at least reduces the amount of polishing fluid absorbed by the sublayer of the polishing pad during the polishing process. The polishing pad of the present invention is useful in polishing microelectronic substrates and especially useful in chemical mechanical planarization of semiconductor wafers.

Description

RELATED APPLICATIONS

[0001] This application is continuation-in-part of U.S. patent application Ser. No. 10 / 898,258 filed on Jul. 26, 2004 which is a conversion of U.S. Provisional Patent Application having Ser. No. 60 / 493,292, filed on Aug. 7, 2003.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention is directed to a polishing pad having a sublayer and a polishing layer that is constructed to reduce the absorption or permeation of polishing fluid into the sublayer through the outer peripheral edge.

[0004] 2. Background Information

[0005] It is typical to use polishing fluid, such as polishing slurry, in conjunction with a polishing pad to polish a microelectronic substrate. The polishing pad can comprise a stacked pad construction including a sublayer. During the polishing process, it is advantageous to at least reduce or minimize the adsorption of slurry into the sublayer. Absorption of slurry into the sublayer can alter or change the compressi...

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