Apparatus and method for manufacturing semiconductor devices
a semiconductor device and apparatus technology, applied in the field of apparatus and a manufacturing method of semiconductor devices, can solve the problem of increasing importance of contamination control
Inactive Publication Date: 2007-02-01
SAMSUNG ELECTRONICS CO LTD
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- Application Information
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Benefits of technology
The present invention provides a semiconductor device manufacturing apparatus and method that includes a load port for disposing containers, a frame for removing less desirable gas, and a gas supplying part for supplying more desirable gas into the container to maintain a positive pressure relative to the less desirable gas in the frame. This results in a more desirable gas flow from the container towards the frame, which helps to improve the manufacturing process of semiconductor devices.
Problems solved by technology
As a semiconductor chip size and a circuit width become finer, contamination control is an increasingly important issue.
Method used
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[0022] It will be understood that if an element or layer is referred to as being “on,”“against,”“connected to” or “coupled to” another element or layer, then it can be directly on, against connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, if an element is referred to as being “directly on”, “directly connected to” or “directly coupled to” another element or layer, then there are no intervening elements or layers present. Like numbers refer to like elements throughout. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.
[0023] Spatially relative terms, such as “beneath”, “below”, “lower”, “above”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass d...
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In an apparatus for manufacturing semiconductor devices, a container is disposable on a load port and is adapted to accommodate one or more wafers. A transfer robot is installed at a frame and the frame is located between the load port and processing equipment. The transfer robot moves the one or more wafers between the processing equipment and the container. A gas supplying part blows a more desirable gas, e.g., a nitrogen gas or an inert gas, into the container through opening holes formed through a wall of the container. The more desirable gas flows (due to a pressure gradient) from the container to the frame to substantially (if not completely) prevent a less desirable gas (e.g., contaminated air) in the frame from entering the container as the one or more wafers are moved between the container and the processing chamber.
Description
PRIORITY STATEMENT [0001] This application claims the priority of Korean Patent Application No. 2005-61340, filed on Jul. 7, 2005, the disclosure of which is incorporated herein in its entirety by reference. BACKGROUND [0002] 1. Field of the Invention [0003] The present invention relates to an apparatus and a method for manufacturing semiconductor devices. [0004] 2. Discussion of the Related Art [0005] As a semiconductor chip size and a circuit width become finer, contamination control is an increasingly important issue. In the past, a semiconductor manufacturing process had been carried out in a clean room where a relatively high level of clean environment was provided for the entire space of the clean room, and mostly an open type container had been used to accommodate or to carry wafers. However, more recent efforts to reduce costs maintain only a process chamber and some other chambers related to the process chamber in a higher level of cleanliness, while a lower level of cleann...
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IPC IPC(8): B65D85/00
CPCH01L21/67017H01L21/67775H01L21/67772H01L21/67393H01L21/02
Inventor HYUN, JONG-SUNKANG, SUNG-WOO
Owner SAMSUNG ELECTRONICS CO LTD