Isothermal Plate Module

Inactive Publication Date: 2008-02-14
JAFFE
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  • Abstract
  • Description
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  • Application Information

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Benefits of technology

[0008]The present invention is to provide an isothermal plate module comprising a plurality of recesses with different orientations and levels. A plurality of heat pipes is provided in the recesses to increase the heat-dissipating coefficient

Problems solved by technology

No matter whether the heat-dissipating plate and heat pipe finally formed in Taiwan Patent Publication No. 510961 has efficiently achieved heat dissipation, the processing procedure indeed has some difficulty in practice.
When the angle of initial processing is slightly deviated, the whole passage will oblique, resulting in the bad products (such as the collapse of the surface of the heat dissipating plate).
Further, since there is a lot of heat-conducting passages, the possibility of error may be relatively increased, resulting in the poor practic

Method used

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Example

[0024]With reference to FIG. 5 and FIG. 6, a second embodiment of the present invention will be described. In the present embodiment, it aims to produce a heat source device having a large area. As shown in the previous embodiment, the recesses 102, 104 of the present invention can be achieved by processing on the end face 14 of the isothermal plate body 10. Therefore, no matter the area of the isothermal plate is large or not, the same processing procedure can be applied. Therefore, in the present embodiment, it is not difficult to form the first recesses 102′ along the first direction and second recesses 104′ along the second direction on the isothermal plate body 10′ having a large area. Further, the heat pipes 12a′, 12b′ can be made to have a length identical to the length or width of the isothermal plate.

[0025]The present invention can be applied to the electronic apparatuses having a high density of heat generation. FIG. 6 shows the isothermal plate module 1′ of the second emb...

Example

[0026]With reference to FIG. 7 and FIG. 8, a third embodiment of the present invention is shown. The reference numerals used in this embodiment are the same as those used in the first embodiment. In the present embodiment, to avoid the first recesses 102 and the second recesses 104, the end face of the isothermal plate body 10 is provided with third recesses 106 along a third direction. Each third recess 106 can be a through hole or a blind hole. The heat pipe 12c can be inserted with an angle of the third direction. Since each third recess 106 of the present embodiment is not long in distance, it is easy to accomplish the drilling operation. To provide the third recesses 106 along the third direction is to increase the heat-conducting and heat-dissipating efficiency. In the drawing, a portion of the heat pipes 12c within the third recesses 106 is tangential to the heat pipes 12a or 12b within the first recesses 102 and the second recesses 104 or tangential to both of them. In this ...

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Abstract

An isothermal plate module includes an isothermal plate body and a plurality of heat pipes. One surface of the isothermal plate body has first recesses extending along a first direction and second recesses extending along a second direction. The first recesses extending along the first direction and the second recesses extending along the second direction are staggered to one another. A level difference is formed between each first and second recess. The heat pipes can be disposed in the first recesses and the second recesses, respectively. The isothermal plate body adheres to the heat source. With the plurality of staggered heat pipes and the working fluid and capillary structure within the heat pipes, an isothermal plate module can be formed.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a structure of an isothermal plate module, and in particular to a structure planarly provided on a heat source element. Further, a plurality of heat pipes having different orientations and levels are disposed in the isothermal plate, thereby to efficiently increase the heat-dissipating coefficient and the heat-dissipating efficiency.[0003]2. Description of Prior Art[0004]Taiwan Patent Publication No. 510961 entitled “Method for manufacturing heat-dissipating plate and heat pipe” discloses a procedure comprising the steps of: processing a heat-dissipating plate, providing a plurality of heat-conducting passages with their distal ends un-penetrated, sealing the open end of each heat-conducting passage and keeping at least one opening, filling the open end with working fluid and performing a vacuum treatment to the kept open end, and sealing the kept open end. The object of said patent docu...

Claims

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Application Information

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IPC IPC(8): F28D15/00
CPCF28D15/0275G02F2001/133628H01L23/427H01L2924/0002H01L2924/00G02F1/133628
Inventor HSU, HUL-CHUN
Owner JAFFE
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