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Substrate processing apparatus and substrate processing method

a substrate processing and processing apparatus technology, applied in the direction of cleaning processes and apparatus, chemistry apparatus and processes, cleaning using liquids, etc., can solve the problems of reducing and achieve the effect of improving the throughput of the substrate processing

Inactive Publication Date: 2008-07-03
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0018]It is an object of the present invention to provide a substrate processing apparatus and a substrate processing method capable of improving the throughput of the substrate processing.

Problems solved by technology

Many transporting processes by the center robot among the substrate transport robot, the reversing unit and the plurality of back surface cleaning units described above reduce the throughput of the substrate processing.
Also in this case, many transporting processes by the center robot among the substrate transport robot, the reversing unit, the plurality of back surface cleaning units and the plurality of top surface cleaning units reduce the throughput of the substrate processing.

Method used

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  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method

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Experimental program
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first embodiment

(1) First Embodiment

[0080](1-1) Configuration of Substrate Processing Apparatus

[0081]FIG. 1 is a schematic view showing a configuration of a substrate processing apparatus according to a first embodiment. FIG. 1(a) is a plan view of the substrate processing apparatus and FIG. 1(b) is a side view in which the substrate processing apparatus of FIG. 1(a) is seen from the direction of the arrow X. FIG. 2 is a schematic view showing a cross section of FIG. 1(a) taken along the line A-A.

[0082]As shown in FIG. 1(a), the substrate processing apparatus 100 includes an indexer block 10 and a processing block 11. The indexer block 10 and the processing block 11 are provided in parallel to each other.

[0083]The indexer block 10 is provided with a plurality of carrier platforms 40, an indexer robot IR and a controller 4. Carriers C that store a plurality of substrates W in multiple stages are placed on the carrier platforms 40, respectively.

[0084]The indexer robot IR is constructed so that it can...

second embodiment

(2) Second Embodiment

[0184](2-1) Configuration of Substrate Processing Apparatus

[0185]FIG. 11 is a schematic view showing a configuration of a substrate processing apparatus according to a second embodiment. FIG. 11(a) is a plan view of the substrate processing apparatus, and FIG. 11(b) is a side view in which the substrate processing apparatus of FIG. 11(a) is seen from the direction of the arrow X.

[0186]As shown in FIG. 11(a), the configuration of the substrate processing apparatus 100a according to the present embodiment is different from the configuration of the substrate processing apparatus 100 according to the first embodiment in that the back surface cleaning units SSR are provided in the region where the top surface cleaning units SS are supposed to be provided (FIG. 1) in the processing block 11. That is, twice as many the back surface cleaning units SSR (eight units) as those of the substrate processing apparatus 100 are provided in the substrate processing apparatus 10a....

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Abstract

A substrate processing apparatus has an indexer block and a processing block. One side of the processing block has a vertical stack of a plurality of top surface cleaning units and the other side of the processing block has a vertical stack of a plurality of back surface cleaning units. Reversing units for reversing the substrate W are provided one above the other between the indexer block and the processing block. For example, one reversing unit is used for reversing the substrate before a back surface cleaning processing by the back surface cleaning unit or for other purposes, and the other reversing unit is used for placing the substrate W after a top surface cleaning processing by the top surface cleaning unit or for other purposes.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a substrate processing apparatus and a substrate processing method for subjecting a substrate to processing.[0003]2. Description of the Background Art[0004]Substrate processing apparatuses have been conventionally used to perform various types of processes on substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for optical disks or the like.[0005]For example, the substrate processing apparatus including a reversing unit that reverses a top surface and a back surface of the substrate is described in JP 2004-146708 A. In such a substrate processing apparatus, a center robot (transport unit) that transports the substrate is arranged in substantially the center of a processing section having a rectangular shape.[0006]In the processing section, a plurality of (four, for example) back surface cleaning units tha...

Claims

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Application Information

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IPC IPC(8): B08B1/02B08B3/00
CPCB08B3/04H01L21/67201H01L21/67766H01L21/67781H01L21/67742H01L21/67754H01L21/67796
Inventor MITSUYOSHI, ICHIROSHIBUKAWA, JUNKIYOKAWA, SHINJIKUREBAYASHI, TOMOHIRO
Owner DAINIPPON SCREEN MTG CO LTD
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